Integrated Optical Communication System for Signal Integrity

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Solution Overview

Problem

Copper data channels face signal attenuation and crosstalk due to radiated electromagnetic energy, which existing techniques like equalization, coding, and shielding can only partially mitigate at the cost of power, complexity, and scalability limitations, while optical communication systems are expensive and complex to manufacture.

Innovation Solution

An integrated optical communication system is developed, comprising a photonic integrated circuit with optical couplers, electronic integrated circuits, and a redistribution structure, where optical couplers are formed using etching processes and covered by a protection film to avoid air bulge issues during high-vacuum processes, and the system is manufactured using a simplified process that reduces production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If copper data channels are used to meet bandwidth requirements, then signal transmission is achieved, but signal attenuation and crosstalk occur due to radiated electromagnetic energy

Engineering Contradiction:

Improvesignal transmission capabilityVSAvoidsignal attenuation and crosstalk

Core Design Contradiction:

Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent substitutes electrical signal transmission through copper channels with optical signal transmission through optical channels, replacing the electromagnetic field-based copper transmission mechanism with photon-based optical transmission. This fundamental substitution eliminates the harmful electromagnetic radiation effects while maintaining high bandwidth capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Object-affected harmful factors

If equalization, coding, and shielding techniques are applied to copper channels, then signal quality is improved, but power consumption, complexity, and cable bulk increase

Engineering Contradiction:

Improvesignal qualityVSAvoidsystem complexity and power requirements

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces the complex electrical signal processing system (requiring equalization, coding, and shielding) with a simpler optical transmission system. The optical channel inherently provides immunity to electromagnetic interference, eliminating the need for these complex mitigation techniques and their associated power and complexity penalties.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If contemporary optical communication systems are implemented, then signal transmission without electromagnetic interference is achieved, but manufacturing cost and process complexity increase

Engineering Contradiction:

Improveelectromagnetic interference immunityVSAvoidmanufacturing cost and process complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent merges the optical communication functions directly into the semiconductor chip substrate, integrating optical waveguides, modulators, and detectors in a unified monolithic structure. This integration eliminates the need for separate optical components and complex assembly processes, significantly simplifying manufacturing while maintaining electromagnetic interference immunity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a universal semiconductor manufacturing process that can produce both electronic and optical circuits on the same substrate using standard CMOS-compatible techniques. This multi-functional approach allows the same fabrication infrastructure to manufacture optical communication systems, reducing specialized tooling and process complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated optical communication system effectively addresses signal attenuation and crosstalk issues without the power and complexity penalties of copper channels, while simplifying the manufacturing process and reducing costs compared to conventional optical systems.

Implementation Method 1

a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers

Methodology Applied

Scientific EffectEvanescent field coupling:

Implementation Method 2

optical couplers are formed using etching processes

Methodology Applied

Scientific EffectEtching:

Data Source

PatentUS10852476B2Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system

Publication Date: 2020.12.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a photonic integrated circuit, an encapsulating material, and a redistribution structure. The photonic integrated circuit includes a coupling surface, a back surface opposite to the coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers. The encapsulating material encapsulates the photonic integrated circuit and revealing the plurality of optical couplers. The redistribution structure is disposed over the encapsulating material and the back surface of the photonic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit.