Integrated Optical Wavelength Dispersion Device Using Photolithography
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Solution Overview
Problem
Existing optical wavelength dispersion devices are large and costly due to their assembly from multiple elements, and silicon-based micromachining technologies struggle to meet precision and structural requirements for grating fabrication in optical communication systems.
Innovation Solution
An optical wavelength dispersion device is developed using a photo-resist layer formed by high energy light source exposure, with a slit and grating on a substrate, and an optional optical reflector, fabricated using semiconductor, glass, metal, or plastic substrates, to create a compact System on Chip (SoC) structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional assembly methods with multiple elements are used, then device functionality is achieved, but device size and cost increase
Solution Approach 1:
The patent combines multiple optical elements (input unit, grating, and output unit) into a single integrated substrate structure. The input unit and grating are formed on the same first substrate through photolithography processes, eliminating the need for separate assembly of multiple discrete elements, thereby reducing device size and complexity while maintaining optical functionality
Solution Approach 2:
The first substrate serves multiple functions simultaneously: it provides mechanical support, hosts the input unit with slit, contains the grating structure for diffraction, and integrates the output unit. This multi-functional integration reduces the number of separate components needed, directly addressing the contradiction between device size and complexity
2Manufacturing precision
If silicon-based micromachining is used, then manufacturing capability is provided, but precision and structural requirements for grating fabrication cannot be met
Solution Approach 1:
The patent replaces mechanical micromachining processes with photolithography-based fabrication. The grating structure is formed by exposing a photo-resist layer to high energy light through a mask, then developing the pattern. This optical fabrication method achieves higher precision for fine grating structures while using well-established semiconductor manufacturing processes, thus improving precision without significantly increasing manufacturing complexity
Solution Approach 2:
The patent uses high energy light sources with wavelengths from 0.01 to 100 nm (including X-ray and EUV) to achieve higher resolution in photolithography. By changing the wavelength parameter of the exposure light to shorter ranges, the fabrication precision of the grating structure is significantly improved, enabling finer features that cannot be achieved with conventional light sources
3Manufacturing precision
If conventional photolithography is used, then fabrication process is simple, but high precision and efficiency in optical signal dispersion cannot be achieved
Solution Approach 1:
The patent employs high energy light sources with wavelengths from 0.01 to 100 nm (X-ray, soft X-ray, or EUV) for photolithography fabrication. These shorter wavelengths enable higher resolution patterning of the grating structure, achieving superior optical signal dispersion precision. The high energy requirement is offset by the ability to use standard photolithography equipment adapted for these wavelengths, maintaining process simplicity while achieving high precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the size and cost of the device while achieving high precision and efficiency in optical signal dispersion, suitable for both optical telecommunications and local communications, with improved diffraction efficiency and surface roughness.
Implementation Method 1
the input unit and the grating are formed from a photo-resist layer by a high energy light source exposure; wherein the wavelength of the high energy light source is from 0.01 to 100 nm
Implementation Method 2
a grating for producing a first light beam form the optical signal for outputting
Data Source
AI summary
An optical wavelength dispersion device includes a first substrate; an input unit formed on the first substrate having a slit for receiving an optical signal; a grating formed on the first substrate for producing a first light beam form the optical signal for outputting; and a second substrate covered on the top of the input unit and the grating; wherein the input unit and the grating are formed from a photo-resist layer by high energy light source exposure.