Integrated Optical-Electrical Probe Card for Semiconductor Die Testing
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Solution Overview
Problem
Current methods for testing semiconductor devices with both optical and electrical inputs/outputs are complex due to the need for multiple probe cards, which complicates alignment and design, leading to functionality issues and layout complexities during wafer-level testing.
Innovation Solution
An integrated optical/electrical probe card that concurrently interfaces with both grating couplers and electrical pads on a semiconductor die, allowing for simultaneous testing of optical, electrical, and optoelectronic devices using a single probe card, thereby simplifying alignment and reducing design constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple probe cards (optical and electrical) are used to test optoelectronic devices, then both optical and electrical inputs/outputs can be tested, but the test system complexity increases and alignment becomes more difficult
Solution Approach 1:
The patent combines optical probe card functionality and electrical probe card functionality into a single integrated probe card. The card includes both optical fibers for optical signaling and electrical needles for electrical signaling, allowing simultaneous testing of both optical and electrical interfaces of optoelectronic devices on semiconductor dies without requiring multiple separate probe cards
Solution Approach 2:
The integrated probe card serves multiple functions: it can perform optical testing via optical fibers, electrical testing via electrical needles, and can test both optical devices and electrical devices on the same semiconductor die. This multi-functional design eliminates the need for separate specialized probe cards for different device types
2Adaptability or versatility
If multiple probe cards are used for testing, then comprehensive testing is possible, but additional alignment steps and alignment equipment are required
Solution Approach 1:
By merging optical and electrical probe card functionalities into one integrated card, the patent eliminates the need for separate alignment procedures for multiple cards. The single probe card requires only one alignment operation to simultaneously establish both optical and electrical connections with the semiconductor die
Solution Approach 2:
The integrated probe card is designed with predetermined spatial relationships between optical fibers and electrical needles, allowing the alignment to be performed once before both optical and electrical testing can proceed without requiring sequential alignment steps
3Adaptability or versatility
If electrical probe card and optical probe card are used concurrently, then both interfaces can be tested, but the die layout and routing become more complex
Solution Approach 1:
The patent merges the interface requirements for electrical and optical testing into a single probe card structure, which simplifies the die layout requirements. The semiconductor die needs to accommodate only one probe card with both optical and electrical contact points, rather than coordinating multiple separate probe cards with potentially conflicting spatial requirements
4Adaptability or versatility
If multiple probe cards are used, then comprehensive testing is achieved, but the risk of probe card crossing and collision increases
Solution Approach 1:
By combining optical and electrical probe card functionalities into a single integrated card, the patent eliminates the physical presence of multiple separate cards that could cross or collide. The single card structure with predetermined spacing between optical fibers and electrical needles prevents interference and collision risks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces alignment complexities, minimizes connector losses, and optimizes die space usage, enabling more versatile and efficient testing of semiconductor devices with improved accuracy and reduced routing complexity.
Implementation Method 1
an optical fiber situated over the top of the semiconductor die can interface with a photonic waveguide of an optical semiconductor device by constructive diffraction using a grating coupler
Data Source
AI summary
A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.