Integrated Optical Interconnect Injection Molded EMI Shield
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Solution Overview
Problem
Conventional fiber opto-electronic transceivers have high manufacturing costs due to separate components that require precise assembly, are prone to electromagnetic interference (EMI) leakage, and suffer from compromised optical coupling performance due to misalignment and non-concentric lens issues.
Innovation Solution
An integrated optical interconnect is manufactured with a receptacle, port, and EMI shield as a single piece using injection molding, ensuring precise alignment and EMI shielding without additional assembly steps, and a lens is molded near the EMI shield aperture to enhance optical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate components (receptacle, port, lens, EMI shield) are manufactured and assembled together, then each component can be optimized independently, but the total manufacturing cost increases and assembly precision requirements increase
Solution Approach 1:
The patent combines multiple separate components (receptacle, port, lens, and EMI shield) into a single integrated housing structure. The port is injection molded as an integral part of the receptacle housing, and the EMI shield is formed as a built-in feature of the same housing, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining manufacturing optimization benefits
2Adaptability or versatility
If multiple separate components are assembled together, then flexibility in component selection is improved, but alignment precision and assembly costs increase
Solution Approach 1:
The port and receptacle are merged into a single injection-molded housing structure, which inherently provides precise alignment between the port aperture and receptacle aperture. This integrated approach eliminates alignment errors that would occur during separate assembly while still allowing flexibility in selecting different optical components (lenses, filters) that can be attached to the standardized port interface
3Object-affected harmful factors
If EMI shielding components (cushions, gaskets, absorbers) are added to block EMI transmission, then EMI protection is improved, but assembly costs and alignment requirements increase
Solution Approach 1:
The EMI shield is merged into the housing structure itself, forming an integral part of the receptacle assembly. The housing includes a shielded cavity with an EMI shield that contains electromagnetic interference, eliminating the need for separate cushions, gaskets, or absorber components. This integrated EMI shielding approach provides effective protection while simplifying the overall assembly process
4Ease of manufacture
If a separate lens cap is used in the interconnect, then lens protection is improved, but concentricity alignment and optical coupling performance may be compromised
Solution Approach 1:
The lens protective features are merged into the port structure itself. The port includes a precision-machined aperture and integrated lens mounting features that maintain concentricity with the optical axis. This integrated design provides lens protection through the port structure and mounting mechanism rather than requiring a separate lens cap, thereby maintaining precise concentricity alignment and optimal optical coupling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, minimizes EMI leakage, and ensures precise alignment and improved optical coupling performance by integrating components and using injection molding for precise alignment and EMI shielding.
Implementation Method 1
The receptacle includes an EMI shield with an aperture sized to allow transmission of an optical signal through the aperture while containing EMI within the receptacle
Implementation Method 2
a lens injection molded near a location of the aperture of the EMI shield
Data Source
AI summary
An integrated optical interconnect. The integrated optical interconnect includes a receptacle for connecting to a first external component. The receptacle includes an EMI shield with an aperture sized to allow transmission of an optical signal through the aperture while containing EMI within the receptacle. The integrated optical interconnect also includes a port injection molded around or within a portion of the receptacle, the port being configured to receive a second external component and a lens injection molded near a location of the aperture of the EMI shield.