Integrated Optical Modulator Chip Size Reduction

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Solution Overview

Problem

Conventional optical modulators have large chip sizes due to the size of DC modulation units and individual components like Polarization Rotators and Beam Combiners, which hinders miniaturization and increases packaging costs.

Innovation Solution

The optical modulator integrates first and second DC modulation units, Polarization Rotators, and Beam Combiners on a Silicon Photonics chip, with a thin film Lithium Niobate chip mounted on top, utilizing a higher electro-optic effect material to achieve miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If DC modulation units and individual components (Polarization Rotators, Beam Combiners) are implemented as separate components, then the optical modulator achieves reliable functionality, but the chip size becomes large and packaging costs increase

Engineering Contradiction:
Improvefunctional reliabilityVSAvoidchip size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent integrates multiple previously separate components (DC modulation units, Polarization Rotators, Beam Combiners) into a single unified optical modulator chip. The Silicon Photonics chip and thin film Lithium Niobate chip are combined to provide both DC and RF modulation functions, polarization rotation, and beam combining capabilities that were previously implemented as individual components, thereby reducing chip size and packaging costs while maintaining functional reliability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated optical modulator chip performs multiple functions simultaneously: DC modulation for phase adjustment, RF modulation for high-speed signal modulation, polarization rotation via the thin film Lithium Niobate chip, and beam combining. This multi-functional integration eliminates the need for separate components and reduces overall system complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If multiple separate components are used to achieve polarization rotation and beam combining, then the optical modulator maintains stable light output, but the device complexity and packaging requirements increase

Engineering Contradiction:
Improvelight output stabilityVSAvoidcomponent integration complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent combines polarization rotation and beam combining functions into the integrated chip structure. The thin film Lithium Niobate chip provides polarization rotation capability that is integrated with the Silicon Photonics chip's waveguide structure, eliminating the need for separate Polarization Rotator and Beam Combiner components while maintaining stable light output through precise waveguide coupling

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This integration approach significantly reduces the chip size of the optical modulator, minimizes propagation loss of high-frequency signals, and stabilizes light output by equalizing waveguide lengths, thereby enhancing modulation band performance and reducing costs.

Implementation Method 1

a phase modulation unit that modulates signal light beams propagating through the two third branched waveguides 218 at a high speed

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Implementation Method 2

a first Direct Current (DC) modulation units 240...modulates signal light beams propagating through the two third branched waveguides 218

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Data Source

PatentUS20250155738A1Optical device, optical transmitter, and optical transceiver
Publication Date: 2025.05.15 FUJITSU OPTICAL COMPONENTS LTD
  • US20250155738A1 patent drawing
  • US20250155738A1 patent drawing
  • US20250155738A1 patent drawing

AI summary

An optical device includes a first chip and a second chip that has a material having a high electro-optic effect. The first chip includes a first waveguide propagating a beam from a first port, a first branched waveguide propagating the beam from the first waveguide, a turned-back parallel waveguide connecting with the first branched waveguide, and a first parallel waveguide propagating the beam from the turned-back parallel waveguide. The first chip includes a second waveguide propagating a beam from a second port, a second branched waveguide propagating the beam from the second waveguide, and a phase adjustor adjusting a phase of the beam propagating in the first branched waveguide. The second chip includes a second parallel waveguide coupling the first parallel waveguide and the second branched waveguide, and a phase modulator adjusting a phase of the beam propagating in the second parallel waveguide.