Integrated Optical-Path Mirror on Sub-Mount for Laser Alignment
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Solution Overview
Problem
Conventional optical devices for optical discs face challenges with high manufacturing costs, complex processes, and positional errors due to integrated semiconductor substrates, which restrict design flexibility and optical performance optimization, especially when dealing with multiple wavelengths.
Innovation Solution
An optical device with a wiring substrate, a sub-mount integrating a semiconductor laser and optical-path conversion mirror, and a light receiving element substrate divided into regions, allowing for adjustable positioning and simplified assembly to optimize light intensity and polarization distribution without requiring complex processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the optical-path conversion mirror, sub-mount, and semiconductor laser are mounted separately on a PDIC, then integration is achieved, but manufacturing costs increase and manufacturing processes become complex
Solution Approach 1:
The patent combines the optical-path conversion mirror and sub-mount into a single integrated component. The mirror is formed directly on the sub-mount substrate, eliminating the need for separate mounting processes and reducing the number of components. This merging approach maintains integration while significantly simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The sub-mount is designed to serve multiple functions: it acts as the mounting substrate for the semiconductor laser, the base for the optical-path conversion mirror, and provides structural support for the entire assembly. This multi-functionality reduces the need for additional components and simplifies the overall device architecture.
2Area of moving object
If multiple components are mounted separately on PDIC, then integration is achieved, but positional errors accumulate
Solution Approach 1:
By integrating the optical-path conversion mirror directly onto the sub-mount, the patent eliminates the separate mounting step that introduces positional errors. The mirror and sub-mount become a single monolithic structure, ensuring precise positional relationship without accumulation of mounting tolerances.
3Area of moving object
If a semiconductor substrate is used for both light receiving element and optical-path conversion mirror, then integration is achieved, but design flexibility is restricted
Solution Approach 1:
The patent segments the device into functionally independent modules: the light receiving element (PDIC) and the optical-path conversion assembly (mirror on sub-mount). This segmentation allows each module to be optimized and manufactured separately with different materials and processes, then integrated together, thereby maintaining design flexibility while achieving functional integration.
Solution Approach 2:
The sub-mount serves as an intermediary component that couples the semiconductor laser with the optical-path conversion mirror. This intermediary structure allows the use of different materials and manufacturing processes for the laser and mirror while maintaining precise optical alignment, thus preserving design flexibility.
4Reliability
If glass mirror is used for optical-path conversion, then optical performance is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive glass mirrors with a cost-effective alternative: a reflective layer deposited directly on the sub-mount substrate. This approach uses inexpensive materials and standard semiconductor manufacturing techniques to achieve the optical-path conversion function, significantly reducing manufacturing costs while maintaining adequate optical performance.
Solution Approach 2:
The patent substitutes a mechanically complex glass mirror mounting system with a simplified planar reflective layer deposited on the sub-mount. This replacement eliminates the need for precise mechanical mounting of glass mirrors while achieving the same optical function through a more manufacturable process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces component complexity, minimizes positional errors, and enhances the flexibility to set optical parameters, enabling improved optical performance and cost-effectiveness for multiple wavelength applications.
Implementation Method 1
an optical-path conversion mirror for reflecting laser light emitted from the semiconductor laser
Data Source
AI summary
An optical device includes a sub-mount 2 mounting first and second semiconductor lasers 1a, 1b and having an onboard part for the semiconductor lasers and an optical-path conversion mirror 7 integrated with each other, and a light receiving element 11 arranged on a light receiving element substrate to have first and second light receiving regions separated from each other by at least one parting line. In the optical device, one light gravity center of an optical spot, which is formed on the light receiving element 11 by homeward flux of light emitted from the first semiconductor laser 1a and reflected by an optical disc 55, and another light gravity center of an optical spot, which is formed on the light receiving element 11 by homeward flux of light emitted from the second semiconductor laser 1b and reflected by the optical disc 55 are together positioned on the parting line.