Integrated Optical Transceiver Assembly for Low-Cost BOSA Packaging
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Solution Overview
Problem
The high material and process costs associated with the conventional packaging of bi-directional optical sub-assemblies (BOSA) in optical communication systems due to the need for separate packaging of optical transmitting and receiving components and multiple assembly steps.
Innovation Solution
An optical transceiver sub-assembly utilizing integrated components such as a polarization splitter and rotator, beam combiner/splitter, and wavelength processor, which are integrated into a chip-based structure, eliminating the need for coaxial packaging and reducing material and process costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate testing of optical modules and optical transceivers is performed, then testing coverage is comprehensive, but testing time and operational efficiency are reduced
Solution Approach 1:
The patent combines the separate testing processes of optical modules and optical transceivers into a single integrated testing operation. The optical transceiver testing device simultaneously tests both the optical module and the optical transceiver housing, eliminating the need for separate testing steps and reducing total testing time while maintaining comprehensive testing coverage.
Solution Approach 2:
The testing device is designed with multi-functional capabilities to handle both optical module testing and optical transceiver testing within a single system. The device includes multiple light sources, detectors, and positioning mechanisms that can simultaneously perform different testing functions, making the testing process more efficient and reducing operational complexity.
2Ease of manufacture
If optical transceiver assembly structure is simplified for ease of manufacture, then manufacturing complexity is reduced, but alignment precision between optical module and housing may deteriorate
Solution Approach 1:
The patent incorporates pre-designed positioning structures and alignment features into the optical transceiver housing during the manufacturing process. These pre-established positioning elements ensure that when the optical module is assembled into the housing, the alignment is automatically maintained within required tolerances, thus achieving both ease of assembly and high precision without requiring complex adjustment mechanisms.
3Reliability
If comprehensive testing of optical transceiver is performed, then product quality is improved, but testing complexity and device requirements increase
Solution Approach 1:
The testing device employs a nested structure where the optical module is placed within the optical transceiver housing during testing. This nesting approach allows the testing system to simultaneously evaluate both the optical module performance and its integration with the housing, including connector alignment and signal transmission, without requiring separate testing equipment for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration approach reduces production costs by simplifying the packaging process and enables miniaturization while maintaining optical functionality, making it suitable for applications in optical access networks and other communication scenarios.
Implementation Method 1
a first light source configured to emit a first test light to a first end of the optical module along a first optical path
Implementation Method 2
a second light source configured to emit a second test light to a second end of the optical module along a second optical path
Implementation Method 3
an optical detector configured to detect the first test light and the second test light
Data Source
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AI summary
This application discloses an optical transceiver sub-assembly and a related product. The optical transceiver sub-assembly includes: an optical transmitting component, a polarization splitter and rotator, an optical receiving component, an optical fiber, a beam combiner/splitter, and a wavelength processor. The optical transmitting component is optically connected to a first port of the beam combiner/splitter. A first optical interface and a second optical interface of the optical receiving component are optically connected to a second port of the beam combiner/splitter and a first port of the wavelength processor respectively. A third port of the beam combiner/splitter, the wavelength processor, and the optical fiber are optically connected to the polarization splitter and rotator separately. The optical transceiver sub-assembly implements bidirectional transmission of an optical wave. The integrated component such as the polarization splitter and rotator is used in the optical transceiver sub-assembly provided in this application, and regardless of whether light is received or transmitted, an optical wave is transmitted by using the chip-based integrated component. Therefore, compared with a BOSA that transmits an optical wave by using a spatial optical path, the optical transceiver sub-assembly disclosed in this application requires fewer material costs and process costs for packaging, thereby reducing production costs.