Integrated Optical Waveguide Interposer for Low-Loss Chip Interconnects
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Solution Overview
Problem
The increasing complexity of integrated circuits (ICs) leads to longer and thinner metal traces, resulting in higher losses and challenges in interconnecting electronic devices, particularly in flip chip technologies where a large number of I/O connections are required in a small area.
Innovation Solution
Integrating an optical waveguide within an interposer, which includes conductive interconnects and optical couplers to facilitate communication between electronic and photonic devices, reducing signal losses by using light signals instead of electrical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip chip technologies are used to increase I/O connections, then the number of connections is improved, but the metal traces become narrower and longer causing higher losses
Solution Approach 1:
The patent replaces electrical signal transmission through metal traces with optical signal transmission through waveguides. This substitution eliminates the signal loss issues inherent in narrow, long metal traces by using light propagation in optical waveguides, which have significantly lower attenuation characteristics.
Solution Approach 2:
The patent changes the transmission medium from electrical conductors to optical waveguides, fundamentally altering the physical parameter of signal carrier. This parameter change enables transmission over longer distances with lower loss by transitioning from electrical to optical domain.
2Area of stationary object
If more I/O connections are integrated in a smaller area, then the device form factor is improved, but the metal traces become narrower causing higher losses
Solution Approach 1:
The patent substitutes optical waveguides for metal traces to enable high-density interconnects without the signal loss penalties. Optical waveguides can be routed more flexibly and with smaller cross-sections, allowing higher connection density in reduced area while maintaining signal integrity.
3Loss of energy
If optical waveguides are integrated in the interposer, then signal transmission loss is reduced, but the device complexity increases
Solution Approach 1:
The patent merges optical waveguide integration directly into the interposer substrate, combining previously separate optical and electronic interconnection functions into a single integrated structure. This consolidation reduces overall system complexity despite the advanced functionality provided.
Solution Approach 2:
The interposer is designed to provide both electrical interconnection through conductive traces and optical interconnection through waveguides within the same structure, enabling multi-functional operation and reducing the need for separate optical coupling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of an optical waveguide in the interposer reduces transmission losses and simplifies the integration of optical and electronic components, increasing yield and decreasing costs.
Implementation Method 1
an optical waveguide defined in a region between the first side and the second side
Implementation Method 2
an optical coupler on the second side configured to enable coupling of light between the one or more photonic devices and the optical waveguide
Data Source
AI summary
An interposer has a first side and a second side and includes an optical waveguide defined in a region between the first side and the second side. The interposer also includes first contacts on the first side configured to be electrically connected to one or more electronic devices, and second contacts on the second side configured to be electrically connected to one or more photonic devices. The interposer also includes conductive interconnects electrically connecting one or more of the first contacts to one or more of the second contacts. The interposer also includes an optical coupler on the second side configured to enable coupling of light between the one or more photonic devices and the optical waveguide.