Integrated Conductive Package Structure Without Cable Connections
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Solution Overview
Problem
Existing packaging structures for electronic components face challenges in enhancing structural strength while maintaining low production costs and reducing power consumption during electrical transmission.
Innovation Solution
The package structure incorporates integrally formed electrically conductive pieces with direct contact to the chip, eliminating the need for additional cables and optimizing the design to enhance structural strength and reduce assembly time and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate cable connections are used between conductive pieces and chip, then ease of manufacture is improved, but structural strength deteriorates
Solution Approach 1:
The conductive piece is designed as an integrally formed structure where the conductive portion and pin are merged into a single piece. This eliminates the need for separate cable connections while significantly enhancing structural strength through the continuous material structure, directly resolving the contradiction between ease of manufacture and structural strength.
2Ease of manufacture
If additional cables are used for electrical connection, then ease of manufacture is improved, but device complexity increases
Solution Approach 1:
The conductive piece integrates the conductive portion and pin into a single component, eliminating the need for additional cables and connection elements. This reduces device complexity by removing unnecessary components while maintaining ease of manufacture through the simplified integral structure.
Solution Approach 2:
The patent extracts and removes the unnecessary cable components from the system, retaining only the essential conductive piece with integrated functionality. This elimination of redundant elements reduces device complexity while preserving manufacturing simplicity.
3Ease of manufacture
If separate cable connections are used, then ease of manufacture is improved, but power consumption increases
Solution Approach 1:
By merging the conductive portion and pin into an integrally formed conductive piece, the patent creates a direct electrical connection pathway that eliminates the need for additional cable connections. This reduces electrical resistance and contact losses, thereby reducing power consumption during electrical transmission while maintaining manufacturing simplicity.
Data Source
AI summary
A package structure includes a substrate, a chip, a first electrically conductive piece and a second electrically conductive piece. The chip is disposed on the substrate. The first electrically conductive piece includes a first electrically conductive portion and at least one first pin. The first pin is connected with the first electrically conductive portion. The first electrically conductive portion is connected with the chip. The first pin is away from the chip. The second electrically conductive piece includes a second electrically conductive portion and at least one second pin. The second pin is connected with the second electrically conductive portion. The second electrically conductive portion is connected with the chip. The second pin is away from the chip. At least one of the first electrically conductive piece and the second electrically conductive piece is an integrally formed structure.