Integrated Package Layout for Compact Power Amplifier Modules
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Solution Overview
Problem
Power amplifier modules are difficult to integrate with other modules, occupying a large space and limiting miniaturization, and traditional grounding methods on PCB boards waste resources and reduce integration levels.
Innovation Solution
An integrated package electronic device structure with a packaging frame and substrate, incorporating a matching and grounding circuit module, connected via resonant inductors and capacitors, allowing direct grounding and frequency-tunable circuit adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional surface mount power amplifier modules are connected as separate modules on PCB board, then the power amplifier can function independently, but it occupies a larger area and reduces integration level
Solution Approach 1:
The patent merges the power amplifier module with matching circuits, grounding circuits, and other functional modules into a single integrated package. The packaging substrate integrates multiple circuit modules that were previously separate, including the power amplifier, matching circuits, and grounding circuits, thereby reducing the overall PCB area while maintaining functional independence through standardized package interfaces.
2Ease of manufacture
If long bias lines are introduced on PCB board to connect DC power supply, then the power amplifier can be powered, but it occupies larger PCB area and increases complexity
Solution Approach 1:
The power supply circuit is integrated within the package substrate along with the power amplifier and other circuits. The bias lines are routed internally on the packaging substrate rather than externally on the PCB, eliminating the need for long external bias lines and reducing PCB area occupation.
3Reliability
If filter circuits are grounded through chip capacitors on PCB board, then the grounding function is achieved, but it occupies larger PCB area and reduces integration
Solution Approach 1:
The grounding circuits and filter circuits are integrated within the package substrate, with grounding connections established internally through the package structure. The chip capacitors and grounding paths are incorporated into the package rather than being separate PCB components, thereby achieving the grounding function while reducing PCB area occupation and improving integration.
4Ease of manufacture
If multiple circuit modules are packaged separately, then each module can be optimized independently, but the overall device size increases and integration level decreases
Solution Approach 1:
Multiple circuit modules including power amplifier, matching circuits, and grounding circuits are packaged together in a single integrated package. The packaging substrate provides a common platform for all modules, allowing them to share ground references and power distribution while maintaining their individual circuit optimizations. This approach reduces the overall device volume compared to separate modules while preserving design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the size of power amplifier modules, improves integration, and enhances the utilization rate and flexibility of the integrated device, reducing development time and costs.
Implementation Method 1
one end of the grounding circuit is electrically connected to the packaging frame via a resonant inductor Ls, and one end of the matching circuit module is electrically connected to the packaging frame via a radio frequency choke RFC. The grounding circuit module includes an integrated capacitor Cs, and the integrated capacitor Cs and the resonant inductor Ls are electrically connected and form a series resonant circuit.
Data Source
AI summary
An embodiment of the present disclosure provides a new integrated package electronic device structure, including a packaging component, including a packaging frame and a packaging substrate, and at least two circuit modules, being packaged on one side of the packaging substrate within the packaging frame, wherein the packaging frame including a merge point for the at least two circuit modules. In the present disclosure, by setting the merge points of at least two circuits packaged within the packaging frame on the packaging frame, the problem of occupying a large area when the integrated electronic device is applied due to setting the merge points on the packaging substrate is avoided, the utilization rate of the integrated electronic device is improved, and the integration and industrialization of the electronic device is facilitated.