Integrated Packaged Light Engine for Optical Signal Transmission
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Solution Overview
Problem
Traditional light engine assembly is cumbersome and costly due to the need for individual component arrangement and redesign of PCBs and circuits for different applications, leading to long development times and high costs.
Innovation Solution
An integrated packaged light engine with a molded interconnection device, ceramic substrate, laser chip, photodiode chip, optical drive chip, transimpedance amplifier chip, and array lens module, where the ceramic substrate is embedded with these components and connected via high-precision pins and circuits, allowing for efficient assembly and direct connection to external circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional separate component arrangement on PCB is used, then each device can be independently selected and arranged, but the development time is long and cost is high due to redesign of PCBs and circuits for different applications
Solution Approach 1:
The patent merges multiple separate components (laser chip, photodiode chip, driving controller, receiving chip, array lens module, optical fiber array) onto a single integrated ceramic substrate. This consolidation eliminates the need to redesign separate PCB boards and circuits for different applications, significantly reducing development time while maintaining adaptability through the modular integrated package design.
Solution Approach 2:
The integrated packaged light engine creates a universal platform that can satisfy different application requirements through standardized interfaces and modular component arrangement. The single ceramic substrate design serves multiple functions simultaneously, allowing the same base structure to be adapted for various optical communication applications without complete redesign.
2Adaptability or versatility
If traditional separate component arrangement on PCB is used, then each device can be independently selected and arranged, but the cost is high due to redesign of PCBs and circuits for different applications
Solution Approach 1:
By combining multiple components into a single integrated package on a ceramic substrate, the patent eliminates the need to manufacture separate PCB boards and circuits for each application. This consolidation reduces manufacturing costs through economies of scale, standardized production processes, and reduced material requirements, while still allowing adaptation to different applications through the modular design.
3Loss of time
If integrated packaged light engine is used, then development time is reduced and cost is reduced, but the integration of multiple components on single substrate increases assembly complexity
Solution Approach 1:
The patent applies preliminary action by pre-assembling and pre-positioning multiple components onto the ceramic substrate during the manufacturing process. The components are precisely positioned and interconnected before the final packaging stage, which simplifies the end-user assembly process and reduces the perceived complexity despite the high level of integration.
4Device complexity
If traditional transmission technology is used, then the system is simpler, but it is difficult to meet the requirements of transmission capacity and transmission speed
Solution Approach 1:
The patent replaces traditional electrical transmission mechanisms with optical transmission technology. By using laser chips for signal transmission and photodiode chips for signal reception, the system achieves significantly higher transmission capacity and speed compared to conventional electrical PCB-based systems, justifying the increased integration complexity through superior performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies design, reduces development time and cost, and enhances bandwidth and communication capacity by integrating signal transmission and reception functions, while improving working efficiency through standardized components and high-density interconnections.
Implementation Method 1
an optical drive chip (4), wherein the laser chip (9) is electrically connected with the optical drive chip (4)... transmitting an external signal to an optical drive chip (4)... the optical drive chip (4) driving the laser chip (9) to emit an optical signal
Implementation Method 2
a photodiode chip (8)... the photodiode is electrically connected with the transimpedance amplifier chip (7)... converting the optical signal into an electrical signal then transmitting it to the transimpedance amplifier by the photodiode chip (8)
Implementation Method 3
an array lens module (5)... the two high-precision PIN columns of the array lens module (5) are aligned with the two holes of the molded interconnection device (2) to achieve passive coupling
Implementation Method 4
a transimpedance amplifier chip (7)... powering the transimpedance amplifier chip (7)... converting the optical signal into an electrical signal then transmitting it to the transimpedance amplifier by the photodiode chip (8)
Data Source
AI summary
Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.