Integrated Connection Pads With Isolated Extensions for Crack Resistance
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Solution Overview
Problem
The decreasing size of semiconductor devices leads to structural integrity issues such as delamination and cracking due to stress, temperature fluctuations, and mismatches in the coefficient of thermal expansion of materials, which existing technologies fail to adequately address.
Innovation Solution
Incorporating electrically-isolated, thermally conductive extensions made of metallic materials that extend from connection pads into the substrate, providing improved thermal dissipation and structural integrity by increasing the bond between layers and reducing stress on the passivation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of semiconductor devices is decreased to increase component density, then productivity and device integration are improved, but structural integrity deteriorates due to stress, temperature fluctuations, and coefficient of thermal expansion mismatches
Solution Approach 1:
The connection pad structure is segmented into multiple functional layers: a conductive pad portion for electrical connection and an electrically-isolated extension portion that extends into the substrate. This segmentation allows the pad to simultaneously provide electrical connectivity and mechanical stress relief, resolving the contradiction between miniaturization and structural integrity.
Solution Approach 2:
The electrically-isolated extension acts as an intermediary element between the connection pad and the substrate. It provides a mechanical bridge that absorbs thermal expansion stresses and prevents direct stress transmission to the pad, thereby maintaining structural integrity while allowing device miniaturization.
2Device complexity
If conventional connection pads are used without extensions, then device complexity is reduced, but thermal dissipation and structural integrity are insufficient
Solution Approach 1:
The connection pad structure is designed to perform multiple functions: the conductive pad portion provides electrical connectivity while the electrically-isolated extension portion provides both mechanical reinforcement and thermal dissipation. This multi-functionality allows a single structure to address multiple reliability concerns without proportionally increasing complexity.
Solution Approach 2:
The pad structure uses composite material architecture combining conductive materials for electrical connection and electrically-isolated materials for mechanical and thermal support. This composite approach enables simultaneous optimization of electrical, mechanical, and thermal properties without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrically-isolated extensions enhance thermal dissipation and structural integrity, reducing the likelihood of cracks and other structural failures in semiconductor devices while leveraging existing manufacturing processes without increasing complexity.
Implementation Method 1
Incorporating electrically-isolated, thermally conductive extensions made of metallic materials that extend from connection pads into the substrate, providing improved thermal dissipation
Data Source
AI summary
Semiconductor devices including electrically-isolated extensions and associated systems and methods are disclosed herein. An electrically-isolated extension may be coupled to a corresponding connection pad that is attached to a surface of a device. The electrically-isolated extensions may extend at least partially through one or more layers at or near the surface and toward a substrate or an inner portion thereof.