Integrated Parallel Peltier Seebeck Chip Fabrication
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Solution Overview
Problem
The existing process for producing thermoelectric conversion elements is inefficient, requiring skilled technicians and significant time due to the need for individual soldering of conductive members, which hampers the production of integrated parallel Peltier Seebeck element chips for direct thermal energy to electric energy conversion.
Innovation Solution
A fabricating process that uses LSI techniques to simultaneously produce multiple integrated parallel Peltier Seebeck element chips by forming conductive members with different Seebeck coefficients on a silicon substrate, connecting them via ohmic contacts, and arranging them in parallel for efficient thermal and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual soldering of conductive members is used to produce thermoelectric conversion elements, then connection reliability is improved, but production time and complexity increase significantly
Solution Approach 1:
The patent merges multiple individual soldering operations into a single batch processing step. Multiple conductive members are simultaneously connected to the common conductive member through a unified soldering process, eliminating the need for sequential individual soldering while maintaining connection reliability. This is achieved by arranging multiple thermoelectric conversion elements in parallel on a single substrate and applying solder to all connections at once.
Solution Approach 2:
The patent performs preliminary arrangement and positioning of multiple conductive members and thermoelectric conversion elements before the final soldering step. The elements are pre-assembled in their correct positions on the substrate with proper alignment, so that when soldering occurs, all connections are ready to be made simultaneously. This preliminary positioning enables batch processing without compromising connection precision.
2Manufacturing precision
If individual soldering of conductive members is used, then connection precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple individual connection operations into a single integrated manufacturing step. By processing multiple conductive members simultaneously in one soldering operation, the overall manufacturing process becomes less complex despite maintaining high connection precision. The unified approach reduces the number of process steps, tool changes, and quality checks needed compared to sequential individual soldering.
Solution Approach 2:
The patent creates a universal substrate structure that can accommodate multiple thermoelectric conversion elements with identical connection geometries. The common conductive member and substrate design allow the same soldering process to be applied universally to all elements, simplifying manufacturing by eliminating the need for element-specific connection procedures while maintaining precise connections for each element.
3Productivity
If multiple chips are produced simultaneously using LSI techniques, then productivity is improved, but manufacturing precision control becomes more difficult
Solution Approach 1:
The patent merges the production of multiple thermoelectric conversion elements into a single batch process on one substrate. All elements are fabricated, positioned, and connected simultaneously using the same manufacturing steps and equipment settings, ensuring consistent precision across all chips. This unified approach maintains precision control while achieving high productivity, as the entire array is processed together rather than individually.
Solution Approach 2:
The patent ensures homogeneity in the manufacturing process by applying identical materials, processes, and conditions to all thermoelectric conversion elements on the substrate. The uniform substrate structure, consistent conductor geometry, and standardized soldering parameters guarantee that precision is maintained across all simultaneously produced chips, eliminating variability that would arise from multiple different manufacturing runs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process significantly reduces fabrication time and enables the rapid production of integrated parallel Peltier Seebeck element chips, facilitating the creation of efficient thermal energy to electric energy conversion systems and heat energy transfer systems.
Implementation Method 1
causing a chemical reaction with oxygen by putting, in an oxidation furnace, the substrate formed with a negative resist for the unoxidized portions corresponding to the mask pattern, altering a remaining portion other than the portions corresponding to the mask pattern into silicon dioxide
Implementation Method 2
forming a thermal conduction terminal portion by connecting, by ohmic contact, surfaces of the adjacent first and second conductive members on one side with a first conductive joining member
Implementation Method 3
when copper wires of two different kinds are connected, the two contact points are held at different temperatures T1 and T2, and one of the conductive wires is cut, then an electromotive force is produced between the cut ends
Implementation Method 4
radiating or absorbing heat is produced other than Joule heat when current flows through conductors of two different kinds which are connected and held at a uniform temperature
Data Source
AI summary
First and second conductive members having different Seebeck coefficients are formed on an insulating substrate. The first and second conductive members are connected by ohmic contact, and the surfaces connected by ohmic contact are covered with a material sheet having a superior heat conductivity and an electric insulating property in the junction surface, such as an aluminum sheet formed with surfaces provided with electric insulating property by alumite treatment or the like. On the opposite side, bonding wires are connected with the first and second conductive members by ohmic contact. The bonding wires are insulated from one another, and used as output terminals of an integrated parallel Peltier Seebeck element chip. The thus produced integrated parallel Peltier Seebeck element chips are connected by one or more serial or parallel cables, to form energy conversion apparatus from electricity to heat and thermal energy transfer apparatus.