Integrated Passive Component with Conductive Pillars for Package Reliability
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Solution Overview
Problem
The integration of passive components in semiconductor device packages faces challenges due to the vulnerability of wire-bond or flip-chip electrical connections and the difficulty in replacing embedded passive components for impedance matching, which hinders miniaturization efforts.
Innovation Solution
An integrated passive component design featuring a capacitor, inductor, and insulation layers with conductive pillars and external contacts, where the inductor is electrically connected to the capacitor, and an external contact is formed to enhance electrical connectivity and facilitate replacement, utilizing a wafer/panel level packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bond or flip-chip technique is used for electrical connections between IPDs and semiconductor device, then electrical connectivity is achieved, but the connections are vulnerable and reliability is reduced
Solution Approach 1:
The patent merges the IPD substrate with the semiconductor device package substrate by forming conductive pillars that extend through the IPD substrate to directly contact the package substrate. This eliminates the need for separate wire-bond or flip-chip connection processes, creating a unified structure where the IPD becomes an integral part of the package, thereby improving reliability and eliminating the vulnerability of traditional connection methods.
2Length of moving object
If passive components are embedded in package substrate to reduce thickness, then miniaturization is achieved, but replacement or change of embedded IPDs becomes difficult
Solution Approach 1:
The patent segments the IPD into a separate replaceable module with its own substrate, while maintaining electrical connection to the package through conductive pillars. This segmentation allows the IPD to be embedded for thickness reduction while preserving the ability to remove and replace the entire IPD module as a unit, effectively solving the contradiction between miniaturization and replaceability.
3Reliability
If conductive pillars with ratio of width to height about 1:7 are used, then electrical connectivity and structural stability are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a particular width-to-height ratio of about 1:7 for the conductive pillars, which represents an optimization of the geometric parameters. This specific ratio provides the optimal balance between electrical connectivity, structural stability, and manufacturability. By establishing this specific parameter range, the patent reduces the precision requirements compared to more stringent designs while still achieving reliable connections.
Data Source
AI summary
An integrated passive component comprises a capacitor, a first passivation layer, an inductor, an insulation layer and an external contact. The first passivation layer surrounds the capacitor. The inductor is on the first passivation layer and electrically connected to the capacitor. The inductor comprises a plurality of conductive pillars. The insulation layer is on the first passivation layer and surrounds each of the conductive pillars. The insulation layer comprises a first surface adjacent to the first passivation layer, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface. A ratio of a width of each of the conductive pillars to a height of each of the conductive pillars is about 1:7. The external contact is electrically connected to the inductor and contacts the second surface of the insulation layer and the side surface of the insulation layer.