Integrated Passive Component Manufacturing via Unified Etching
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Solution Overview
Problem
The existing methods for manufacturing passive components in integrated circuits require complex and lengthy processes, involving multiple photo masks and etching steps, which increase costs and can lead to decreased yield and higher resistance in capacitor electrodes, affecting the quality factor of capacitors.
Innovation Solution
A method that defines connecting, capacitor, and inductance regions on a substrate with a first metal layer and insulating layer, using etching processes to form outer connecting pads, electrodes, and inductance structures, followed by dielectric deposition and filling with a second metal layer, simplifying the process and reducing the number of required steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple photo masks and etching steps are used to manufacture passive components, then the manufacturing precision and component quality are improved, but the device complexity and manufacturing time increase significantly
Solution Approach 1:
The patent combines the formation of outer connecting pads, capacitor electrodes, and inductance structures into a single integrated etching process. The method uses a unified pattern transfer approach where all passive component features are defined simultaneously through one photo mask and etching sequence, eliminating the need for separate processing steps for each component type. This merging of operations reduces process complexity while maintaining the required manufacturing precision through careful process design.
Solution Approach 2:
The patent employs a universal etching process that can form multiple different passive component structures (connecting pads, capacitor electrodes, inductance structures) using the same process parameters and equipment setup. The single etching step serves multiple functions by creating various component geometries simultaneously based on the pattern design, thereby reducing the number of specialized process steps needed while maintaining high manufacturing precision across all component types.
2Manufacturing precision
If multiple photo masks and etching steps are used to manufacture passive components, then the component quality is improved, but the manufacturing time and production cost increase
Solution Approach 1:
The patent merges multiple sequential photo masking and etching operations into a single integrated process step. By combining the formation of outer connecting pads, capacitor electrodes, and inductance structures into one simultaneous etching operation, the total manufacturing time is dramatically reduced while the component quality is maintained through optimized process parameters and unified pattern transfer methodology.
3Manufacturing precision
If multiple photo masks and etching steps are used to manufacture passive components, then the component quality is improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete manufacturing operations into a single integrated process, thereby reducing the cumulative cost of materials, equipment usage, and labor associated with multiple separate photo masking and etching steps. The unified approach maintains high component quality while lowering overall manufacturing cost by eliminating redundant process overhead.
Solution Approach 2:
The patent creates a universal process that can manufacture different passive component structures using the same equipment and process parameters, thereby amortizing the manufacturing cost across multiple component types produced in a single operation. This multi-functionality reduces the need for specialized expensive equipment and process setup for each component type, lowering the overall manufacturing cost while maintaining high component quality.
4Manufacturing precision
If multiple etching steps are used to form capacitor electrodes, then the electrode quality is improved, but the electrode resistance increases
Solution Approach 1:
The patent combines the etching steps for forming capacitor electrodes into a single continuous process operation. This unified etching approach maintains electrode quality by ensuring uniform pattern transfer and consistent etch depth control, while simultaneously reducing electrode resistance by minimizing the number of process interruptions and re-deposition cycles that would otherwise be required between separate etching steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces the number of steps, and improves the quality factor of capacitors by lowering the resistance of the top and bottom electrodes, while allowing for the integration of outer connecting pads and inductance structures in a more efficient manner.
Implementation Method 1
a first etching process is performed on the insulating layer so as to remove the insulating layer positioned in the connecting region, the insulating layer positioned in the inductance region and a part of the insulating layer positioned in the capacitor region
Implementation Method 2
a dielectric layer is deposited on the substrate
Data Source
AI summary
A method for manufacturing passive components is disclosed. First, a substrate is provided, and a connecting region, a capacitor region and an inductance region are defined in the substrate. The substrate includes a first metal layer and an insulating layer on the first metal layer. Subsequently, the insulating layer is etched, and then the first metal layer is etched. Thus, an outer connecting pad in the connecting region and a bottom electrode in the capacitor region are formed simultaneously, and a part of the insulating layer on the bottom electrode remains. Thereafter, a dielectric layer is deposited, and then a dual damascene copper process is performed to form an inductance structure and a top electrode of a capacitor in the dielectric layer simultaneously. Next, a passive layer is deposited and an etching process is thereafter performed to expose the outer connecting pad.