Integrated Passive Component with Hybrid Coil Structure
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Solution Overview
Problem
Existing methods for integrating coils with semiconductor bodies in standard fabrication processes are limited in producing high-rated coils efficiently and reliably, and do not effectively incorporate magnetic field sensors or allow for transformer coupling within a single housing.
Innovation Solution
An integrated passive component is developed with a semiconductor body on a metal substrate, featuring a coil with multiple turns above a passivation layer, where the lower part is formed as traces and the upper part as bonding wires, allowing for cost-effective and reliable integration of coils and magnetic field sensors, with the option for a second coil for transformer coupling, all within a standard semiconductor fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coils are integrated using standard semiconductor fabrication processes, then manufacturing cost and reliability are improved, but the coil rating is limited and cannot achieve high-rated coils above 5 or 10
Solution Approach 1:
The patent combines trace sections and wire sections into a single integrated coil structure. The trace sections are formed using standard semiconductor fabrication processes in the lower part of the coil, while wire sections are bonded in the upper part, creating a hybrid coil that achieves high rating (above 5, preferably above 10) while maintaining integration reliability through standard processes.
Solution Approach 2:
The coil is designed with a longitudinal axis extending in the vertical dimension above the semiconductor body surface. The trace sections form the lower part near the surface, while wire sections extend upward, utilizing the vertical dimension to achieve high coil rating without compromising the standard planar fabrication process.
2Productivity
If additional process steps are used to form high-rated coils, then coil rating is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The coil is segmented into trace sections formed by standard semiconductor fabrication processes and wire sections formed by subsequent bonding processes. This segmentation allows each part to be optimized independently while maintaining overall simplicity - the trace sections use existing metal layers and the wire sections are added only where needed to achieve high rating.
Solution Approach 2:
The trace sections of the coil are formed in advance during the standard semiconductor fabrication process before the final packaging stage. This preliminary formation of the lower coil part eliminates the need for complex post-fabrication coil formation processes, reducing overall manufacturing complexity.
3Productivity
If coils are formed entirely as wire sections, then coil rating is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
Different sections of the coil have different structures optimized for their specific functions. The lower part of the coil uses trace sections formed by standard fabrication processes for cost-effective manufacturing, while the upper part uses wire sections for achieving high rating. This local differentiation optimizes both cost and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the cost-effective and reliable integration of high-rated coils and magnetic field sensors, enabling applications such as magnetic field-free position measurement, calibration of magnetic field sensors, and data transmission through changing magnetic fields, while increasing the dynamic measuring range for rapidly changing magnetic fields.
Implementation Method 1
the top part of the coil can be produced by means of a bonding process by drawing a bonding wire from one metal surface and to another metal surface
Implementation Method 2
data transmission through changing magnetic fields, while increasing the dynamic measuring range for rapidly changing magnetic fields
Data Source
AI summary
An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a passivation layer formed on the surface, an integrated circuit formed near the surface of the semiconductor body, whereby the integrated circuit is connected to metal surfaces via traces formed below the passivation layer, a part of the metal surfaces is connected to pins via bonding wires, and a first coil formed above the passivation layer, whereby the first coil with a plurality of turns has a longitudinal axis formed substantially parallel to the surface of the semiconductor body, and in a lower part of the first coil, said part which is formed substantially parallel to the longitudinal axis of the coil on the surface of the semiconductor body, parts of a plurality of turns are formed as sections of traces.