Integrated Passive Components in Stacked IC Packages
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Solution Overview
Problem
High power processor packages require large external passive components like inductors and capacitors for voltage regulation, which occupy space and increase complexity, especially as the number of processing cores increases, and existing solutions often isolate these components from the core processing circuitry to achieve better performance.
Innovation Solution
Integrating magnetic core inductors and high-density capacitors on the uncore die within a 3D-stacked processor package, allowing for a fully integrated voltage regulator and reducing the need for external components, thereby simplifying the package design and increasing inductance density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large external passive components (inductors and capacitors) are used for voltage regulation, then power delivery performance is improved, but package area and complexity increase
Solution Approach 1:
The patent combines multiple passive components (inductors, capacitors) and the voltage regulator into a single integrated module that is then incorporated into the processor package. This merging of previously separate components into one unified structure reduces the total package area while maintaining the required power delivery performance.
2Reliability
If passive components are isolated from high speed digital circuitry, then Q factor is improved, but connection complexity increases
Solution Approach 1:
The patent extracts the passive components and voltage regulator into a separate integrated module that is then connected to the processor cores. This extraction allows the passive components to be isolated from high-speed digital circuitry, improving Q factor, while the modular design manages connection complexity through standardized interfaces.
3Power
If more processing cores are added to increase processing power, then computational capability is improved, but the number of required passive components increases
Solution Approach 1:
The patent creates a universal voltage regulator module that can serve multiple processor cores through shared passive components. Instead of requiring separate inductors and capacitors for each core, the integrated module provides power delivery to multiple cores, reducing the total quantity of passive components needed while supporting increased computational capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of connection bumps, alleviates area scaling concerns, and allows for more efficient power delivery with higher inductance density and smaller volume, while also enabling independent testing of the voltage regulator and reducing the complexity and cost of the substrate.
Implementation Method 1
Integrating magnetic core inductors and high-density capacitors on the uncore die within a 3D-stacked processor package
Implementation Method 2
Integrating magnetic core inductors and high-density capacitors on the uncore die within a 3D-stacked processor package
Data Source
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AI summary
Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, and a passive device attached to the first die and coupled to the power supply circuit.