Integrated Patch Antenna With High-K Dielectric Cavity
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Solution Overview
Problem
Current RF systems face challenges in integrating antennas with RFIC dies efficiently, particularly at higher frequencies, due to limitations in antenna design and manufacturing processes, which affect performance and frequency range.
Innovation Solution
The integration of patch antennas within an InFO package structure using a redistribution structure, incorporating a ground plane, antenna pads, conductive pillars, and dielectric materials with varying dielectric constants to optimize RF characteristics and frequency range, including the use of low-κ and high-κ dielectric materials to enhance radiation efficiency and reduce antenna dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antennas are designed separately from RFIC dies and combined in packaging, then antenna performance is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the antenna structure with the RFIC die by integrating the antenna cavity, ground plane, and antenna pad directly into the semiconductor substrate during the semiconductor manufacturing process. This eliminates the need for separate antenna fabrication and packaging steps, combining what were previously separate components into a single integrated structure that achieves both improved performance and simplified manufacturing
Solution Approach 2:
The semiconductor substrate serves multiple functions: it acts as both the RFIC die substrate and the antenna structure substrate. The same manufacturing processes that create the RFIC circuits also create the antenna cavity, ground plane, and radiation elements, making the substrate universal for both signal processing and electromagnetic radiation functions
2Reliability
If high-K dielectric material is used between antenna cavity and antenna pad, then radiation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the dielectric constant parameter of the material between the antenna cavity and antenna pad by using high-K dielectric material instead of traditional low-K materials. This parameter change increases the electric field concentration and improves radiation efficiency. The high-K material is integrated using standard semiconductor deposition techniques, maintaining ease of manufacture while achieving improved RF performance
3Area of moving object
If antenna dimensions are reduced for smaller footprint, then device area is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent addresses footprint reduction by utilizing the vertical dimension through the antenna cavity structure. Instead of only reducing lateral dimensions, the design employs a three-dimensional cavity architecture that maintains antenna functionality with reduced planar footprint. The cavity depth and vertical material layering provide the necessary electromagnetic properties without requiring proportionally smaller lateral dimensions, thereby avoiding excessive precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reflection coefficient and radiation efficiency of RF signals, allowing for higher frequency operations and a reduced footprint of RF devices while maintaining performance, suitable for applications like cellular telephone antennas and automotive control systems.
Implementation Method 1
A device includes a first pad of conductive material over a substrate, electrically connected to a ground plane; an insulating fill material over the first pad; a first conductive pillar electrically connected to the first pad, extending through the insulating fill material; a controller die connected to the substrate; a pad of dielectric material over a top surface of the insulating fill material and the first conductive pillar; and a second pad of conductive material over the pad of dielectric material, electrically connected to the controller die
Implementation Method 2
The integration of patch antennas within an InFO package structure using a redistribution structure, incorporating a ground plane, antenna pads, conductive pillars, and dielectric materials with varying dielectric constants to optimize RF characteristics and frequency range
Data Source
AI summary
A device includes a ground plane electrically connected to a proximal end of at least one conductive pillar and an antenna pad substantially parallel to the ground plane, wherein the antenna pad is separated from a distal end of the at least one conductive pillar by a dielectric pad having a first dielectric constant, wherein the ground plane, the at least one conductive pillar, and the dielectric pad surround an antenna cavity filled with a dielectric fill material having a second dielectric constant different from the first dielectric constant.