Integrally Formed Heat Sink for PCB Thermal Management
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Solution Overview
Problem
Existing printed circuit boards (PCBs) face challenges in efficiently dissipating heat from surface-mounted components due to low thermal conductivity between critical zones and the solder connection, with conventional heat sink solutions being expensive, time-consuming, and limited in heat transfer efficiency.
Innovation Solution
The integration of a heat sink configured as a single piece with fins on one side and a mounting side on the PCB, where the heat sink is coupled through apertures formed in the PCB layers, reducing thermal resistance and enhancing heat transfer by direct interface with surface-mounted components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper coins with separately attached fins are used to draw heat through the PCB, then heat dissipation capability is improved, but manufacturing complexity and cost increase due to multiple post-formation processes
Solution Approach 1:
The patent combines the copper coin base and fins into a single integrally formed heat sink component. This eliminates the need for separate fin attachment processes, reducing manufacturing complexity while maintaining the heat dissipation functionality. The integrated structure is inserted directly into the PCB aperture as one piece, avoiding multiple post-formation operations.
Solution Approach 2:
The heat sink with fins is pre-formed as a complete integrated component before insertion into the PCB aperture. This preliminary formation of the complete heat sink structure eliminates the need for subsequent fin attachment processes, simplifying the overall manufacturing workflow while achieving the desired heat dissipation performance.
2Area of stationary object
If separately attached fins are used on copper coins, then heat dissipation surface area is increased, but thermal resistance increases due to limited heat transfer between copper coin and fin
Solution Approach 1:
The copper coin and fins are merged into a single integrally formed component, eliminating the interface between separate parts. This removes the thermal resistance that would exist at the attachment interface, ensuring efficient heat transfer from the copper coin base through the fins to the surrounding environment while maintaining increased heat dissipation surface area.
3Temperature
If multiple post-formation processes are used to implement heat sink on PCB, then heat dissipation is enhanced, but manufacturing time and cost increase
Solution Approach 1:
The complete heat sink structure with fins is pre-formed as an integrated component before insertion into the PCB aperture. This preliminary formation eliminates the need for multiple subsequent assembly operations, significantly reducing manufacturing time and process complexity while achieving enhanced heat dissipation efficiency.
Solution Approach 2:
The base and fins are combined into a single integrally formed heat sink component, eliminating the need for separate attachment processes. This merging of components streamlines the manufacturing process to a single insertion operation, reducing both time and cost while maintaining the enhanced heat dissipation capability provided by the fin structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively draws heat from surface-mounted components through the PCB, reducing thermal resistance and weight while improving heat dissipation efficiency, making it a more cost-effective and efficient solution compared to conventional methods.
Implementation Method 1
heat must be conducted through the PCB
Implementation Method 2
the heat may be extracted from a component using a passive heat exchanger, such as a heat sink
Data Source
AI summary
Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.