Integrated PCB Output Inductor for Compact Power Converter Design
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Solution Overview
Problem
Conventional semiconductor packages with pre-formed output inductors have a large form factor and poor thermal performance, which increases the overall size and degrades thermal dissipation, posing a challenge for compact and efficient power converter designs.
Innovation Solution
A semiconductor package with an integrated output inductor on a printed circuit board (PCB) using a stacked architecture, where conductive clips and segments form a continuous wire winding around a core, reducing the package height and enabling enhanced thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pre-formed output inductor is used in conventional semiconductor packages, then the inductor can be easily integrated with power transistors, but the overall form factor increases and thermal performance degrades
Solution Approach 1:
The patent merges the output inductor with the PCB by fabricating the inductor winding as a conductive trace pattern on the PCB substrate. This integration eliminates the need for separate pre-formed inductor components and their associated mounting structures, thereby reducing the overall package form factor while maintaining ease of integration through a unified manufacturing process
Solution Approach 2:
The patent transitions the inductor from a three-dimensional discrete component to a two-dimensional planar structure fabricated on the PCB surface. This dimensional reduction allows the inductor to occupy significantly less space while maintaining its electrical functionality, directly addressing the form factor issue
2Ease of manufacture
If a pre-formed output inductor is used in conventional semiconductor packages, then the inductor can be easily integrated with power transistors, but thermal dissipation performance degrades
Solution Approach 1:
The patent combines the inductor structure with the PCB thermal management system, allowing the PCB substrate and its attached heat sink to serve dual functions: electrical connectivity and thermal dissipation. This eliminates the thermal interface issues between separate components and enables direct heat transfer from power devices through the PCB to the heat sink
Solution Approach 2:
The PCB substrate is designed to perform multiple functions simultaneously: it serves as the circuit board for electrical connections, as the structural support for the inductor winding, and as the thermal conduction path to the heat sink. This multi-functionality resolves the contradiction by making the same structure serve both integration and thermal management needs
3Adaptability or versatility
If the output inductor is placed side by side with power transistors on the PCB, then the package can accommodate all components, but the overall size increases
Solution Approach 1:
The patent merges multiple functional layers into a single integrated structure: the inductor winding is fabricated as a conductive pattern on the PCB, eliminating the need for separate inductor components and their mounting space. This allows all components to be accommodated within a compact footprint while maintaining electrical functionality
Solution Approach 2:
The inductor winding is nested within the PCB structure itself, with the conductive trace pattern forming the inductor geometry directly on the board surface. This nesting approach allows the inductor to occupy the same physical space as the PCB circuitry rather than requiring additional lateral space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall form factor and improves thermal performance by embedding the inductor within the PCB, allowing for more compact and efficient power converter designs while maintaining high thermal dissipation capabilities.
Implementation Method 1
conductive clips and segments form a continuous wire winding around a core
Implementation Method 2
enhanced thermal dissipation capabilities
Data Source
AI summary
A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.