Integrated Photodetector Array and Electronics Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current CT imaging systems face inefficiencies due to the exponential increase in pixels, which complicates the interconnect between photodiode arrays and electronics, leading to increased fabrication costs and reduced resolution.
Innovation Solution
The integration of photodetector arrays and data acquisition electronics on the same substrate eliminates the need for complex interconnects and reduces fabrication costs, enabling finer resolution and programmable pixel configurations by co-locating electronics next to photodetectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photodetector arrays and electronics are fabricated separately and connected through packaging or wafer bonding, then device functionality is achieved, but interconnect complexity and fabrication costs increase
Solution Approach 1:
The patent merges the photodetector array and data acquisition electronics onto a single substrate, eliminating the need for separate packaging or wafer bonding processes. This integration directly reduces interconnect complexity and fabrication costs while maintaining all necessary device functionalities.
2Measurement precision
If the number of pixels in CT detector increases exponentially, then imaging resolution improves, but interconnect complexity between photodiode array and electronics increases
Solution Approach 1:
By integrating electronics directly on the same substrate as the photodetector array, the patent eliminates the need for complex external interconnects. This allows the number of pixels to increase exponentially without proportionally increasing interconnect complexity, as the electronics are co-located with the photodetectors.
Solution Approach 2:
The patent transitions from a planar interconnect architecture to a three-dimensional integrated architecture where electronics are stacked or positioned in proximity to the photodetector array. This dimensional change allows for efficient signal routing without increasing lateral interconnect complexity.
3Reliability
If photodetector array is attached to electronics by wafer to wafer bonding, then electrical connection is established, but fabrication time and cost increase
Solution Approach 1:
The patent combines the fabrication of photodetectors and electronics into a single monolithic substrate, eliminating the time-consuming wafer bonding process. Electrical connections are established through standard semiconductor fabrication techniques during the same manufacturing run, significantly reducing fabrication time while maintaining connection reliability.
4Ease of operation
If photodetector array is fabricated on separate wafer and attached to package, then device assembly is completed, but resolution and signal processing efficiency decrease
Solution Approach 1:
The patent integrates the photodetector array and electronics on a single substrate, eliminating the need for separate packaging and attachment steps. This integration maintains ease of operation through standardized fabrication processes while significantly improving detector resolution by reducing interconnect bottlenecks and enabling finer pixel pitch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces interconnect complexity, fabrication costs, and enhances image quality by eliminating bottlenecks in signal processing, improving noise, speed, and power dissipation while allowing for multiplexing of pixels into a single channel.
Implementation Method 1
the detector assembly typically utilizes a scintillator assembly to convert incident radiation (e.g., x-rays) into light for detection at an array of light detection devices
Implementation Method 2
The light produced by the scintillator assembly is typically received/detected and processed by a detection device/assembly (e.g., a light sensitive photodiode array), which converts the light from the scintillator assembly into an electronic signal
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.