Manufacturing Method for Photodiode Integrating Hall Induction, Photodiode, and Photoelectric Keyboard
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Solution Overview
Problem
Traditional photodiodes require separate packaging for lighting and signal transmission functions, increasing circuit complexity and cost in photoelectric mechanical keyboards.
Innovation Solution
A manufacturing method integrates Hall induction, red, blue, and green light emitting chips with a color control chip, forming a single photodiode that includes independent Hall induction and color electrical control loops, packaged with epoxy resin and filtering adhesives for protection and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate packaging process is used for light-emitting diodes and infrared diodes, then each diode can have single photoelectric characteristic, but device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent combines multiple photoelectric components (light-emitting diode, infrared diode, and Hall induction chip) into a single integrated packaging structure. The support integrates multiple packaging cavities that house different chips, with their electrodes welded to pins to form electrical control loops. This merging eliminates the need for separate packaging processes and reduces circuit design complexity while maintaining the reliability of each component's photoelectric characteristics.
Solution Approach 2:
The support structure serves multiple functions simultaneously: it provides mechanical support, electrical connections through pins, and integrated packaging for multiple chips. The packaging structure is designed to accommodate both light-emitting and infrared diodes along with Hall induction chip, making it a universal platform that eliminates the need for separate packaging processes and reduces overall device complexity.
2Adaptability or versatility
If multiple optoelectronic components are used, then dual function of lighting decoration and signal transmission is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple optoelectronic components into a single integrated packaging structure. The support contains packaging cavities for light-emitting diode, infrared diode, and Hall induction chip, all connected through shared pins. This integration reduces the number of separate manufacturing steps, assembly operations, and testing procedures, thereby lowering manufacturing costs while maintaining dual functionality for lighting decoration and signal transmission.
Solution Approach 2:
The integrated packaging structure provides multi-functionality by housing components that enable both lighting decoration (through light-emitting diode) and signal transmission (through infrared diode and Hall induction chip). The universal support structure and shared electrical connections reduce manufacturing complexity and cost compared to producing and assembling separate components.
3Reliability
If separate packaging is used for each diode, then single photoelectric characteristic is maintained, but production cost increases
Solution Approach 1:
The patent combines multiple diodes and Hall induction chip into a single packaging structure with shared support and pins. This merging reduces production costs by eliminating redundant manufacturing steps, reducing inventory of separate components, and simplifying assembly and testing processes, while each component's photoelectric characteristic remains intact through proper electrical isolation and connection design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated photodiode simplifies circuit design, reduces components, saves space, and lowers costs while providing quick response, high sensitivity, and strong anti-interference performance for electromagnetic induction switching.
Implementation Method 1
The first packaging cavity is dispensed and packaged with epoxy resin adhesive or silica gel, and baked and cured
Implementation Method 2
The second packaging cavity is dispensed and packaged with filtering adhesive, and baked and cured
Implementation Method 3
The electrodes of the visible light emitting chip, the color control chip and the Hall induction chip are welded to the pins respectively to form the electrical control loop
Data Source
AI summary
In a manufacturing method for the photodiode integrating Hall induction, a support is provided, there is a base and a plurality of pins on the support, and the base has a first packaging cavity and a second packaging cavity, and there is a plurality of pins on the base; the visible light emitting chip and the color control chip are fixed in the first packaging cavity, and the Hall induction chip is fixed in the second packaging cavity; the electrodes of the visible light emitting chip, the color control chip and the Hall induction chip are welded to the pins respectively to form the electrical control loop; the first packaging cavity is dispensed and packaged with epoxy resin adhesive or silica gel, and baked and cured; and the second packaging cavity is dispensed and packaged with filtering adhesive, and baked and cured to form the photodiode integrating Hall induction.