Integrated Photonics Module for 3D Mapping
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Solution Overview
Problem
Current miniature optical projectors for 3D mapping and other applications face challenges in integrating optoelectronic components and optical elements into a single, cost-effective, and reliable package that maintains high optical quality and efficiency.
Innovation Solution
The development of photonics modules that include a semiconductor substrate with an edge-emitting or surface-emitting radiation source, a reflector, and optical elements such as lenses or diffractive optical elements, integrated to project patterned light efficiently, with features like MEMS scanning mirrors and radiation sensors for monitoring and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optoelectronic components and optical elements are integrated into a single package, then device miniaturization and cost-effectiveness are improved, but manufacturing complexity and alignment precision requirements increase
Solution Approach 1:
The patent integrates the radiation source, reflector, and optical elements into a single integrated photonics module mounted on a substrate. This merging of components achieves miniaturization while managing complexity through systematic integration architecture
Solution Approach 2:
The integrated module is divided into distinct functional segments: radiation source section, reflection section, and optical element section. Each segment can be independently optimized and manufactured, then assembled into the complete integrated package
2Productivity
If multiple components are integrated in a single package, then productivity and cost-effectiveness are improved, but manufacturing precision requirements worsen
Solution Approach 1:
Alignment features and mounting structures are pre-formed on the substrate during substrate fabrication. Components are designed with built-in alignment features that guide their positioning, eliminating the need for complex post-assembly alignment procedures
Solution Approach 2:
The patent replaces complex mechanical alignment systems with substrate-based mounting structures. Components are secured through integrated mounting features on the substrate, eliminating the need for separate mechanical alignment and fastening mechanisms
3Ease of manufacture
If conventional separate packaging is used, then manufacturing simplicity is maintained, but device size and system cost increase
Solution Approach 1:
Multiple discrete components are merged into a single integrated photonics module that functions as one compact unit. This eliminates the need for separate packaging of individual components while maintaining manufacturing feasibility through standardized integration processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These modules enable high-reliability, low-cost production of integrated photonics systems suitable for 3D mapping and other applications, offering improved optical quality and flexibility in projecting patterned light, while also being adaptable for free-space optical communications.
Implementation Method 1
A reflector is fixed to the substrate in a location on the axis and is configured to reflect the optical radiation in a direction that is angled away from the surface
Implementation Method 2
One or more optical elements are mounted on the substrate so as to receive and transmit the optical radiation reflected by the reflector
Data Source
AI summary
Optical apparatus includes a semiconductor substrate and one or more radiation sources, mounted on a surface of the substrate and configured to emit optical radiation. A scanning mirror is mounted on the substrate and is configured to scan the reflected optical radiation over a predetermined angular range in a direction that is angled away from the surface.