Integrated PHY Module Reducing Motherboard Footprint

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Solution Overview

Problem

Conventional host computers require separate footprints for Ethernet PHY devices and connector modules on the motherboard, leading to increased surface area consumption.

Innovation Solution

An integrated module that combines a physical layer network device, a circuit board with a chipset, a lead frame, and an RJ45 receptacle, where the circuit board is directly mounted to the receptacle, reducing the cumulative footprint by integrating these components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the PHY device and connector module are mounted separately on the motherboard, then each component can be independently manufactured and assembled, but the total motherboard surface area consumption increases

Engineering Contradiction:

Improveindependent manufacturing and assemblyVSAvoidmotherboard surface area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent combines the PHY device and connector module into a single integrated module that is mounted as one unit on the motherboard. The PHY device is positioned in a first region of the module, the connector module is positioned in a second region of the module, and the isolation module is positioned between them, allowing all components to be assembled together in advance and mounted to a single location on the motherboard, thereby reducing the total surface area required.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integration structure nests multiple functional components within a compact module footprint. The isolation module is positioned between the PHY device and connector module, creating a nested arrangement where components are closely packed together in a hierarchical structure, maximizing space utilization and minimizing the overall footprint on the motherboard.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Area of stationary object

If the PHY device and connector module are integrated into a single module, then the motherboard surface area is reduced, but the manufacturing complexity increases

Engineering Contradiction:

Improvemotherboard surface areaVSAvoidmodule integration complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The integrated module is segmented into distinct functional regions: the PHY device in a first region, the connector module in a second region, and the isolation module positioned between them. This segmentation allows each component to be manufactured and tested independently before being assembled into the integrated module, reducing the complexity of manufacturing while maintaining the space-saving benefits of integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The isolation module serves as an intermediary component positioned between the PHY device and the connector module. This intermediary structure facilitates the integration by providing electrical isolation and signal routing, enabling the PHY device and connector module to function together in the integrated assembly without direct electrical connection, thereby simplifying the overall manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If separate footprints are used for PHY device and connector module, then component placement is simplified, but the cumulative footprint increases

Engineering Contradiction:

Improvecomponent placementVSAvoidcumulative footprint

Core Design Contradiction:

Ease of operationVSArea of moving object

Solution Approach 1:

The patent merges the PHY device and connector module into a single integrated module with defined first and second regions. This merging allows the entire assembly to be placed as one unit on the motherboard, simplifying the placement operation while the internal regional structure maintains the functional separation and ease of assembly of the individual components.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8029320B1Integrated module including physical layer network device, receptacle and physical layer isolation module

Publication Date: 2011.10.04 INTEL CORP

AI summary

An embodiment may include an integrated module that may include a physical layer network device and a cable connector receptacle. The physical layer network device may be physically and electrically coupled to the cable connector receptacle. The physical layer network device may include a circuit board. The circuit board may be directly physically coupled to the receptacle. The circuit board also may be electrically coupled to the receptacle. Many alternatives, variations, and modifications are possible.