Integrated Piezoelectric Composite With Support Circuit
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Solution Overview
Problem
Existing systems for integrating piezoelectric composites with support circuits on a substrate are not optimized, leading to difficulties in mounting and wiring, which hinders efficient energy harvesting and data transmission.
Innovation Solution
The integration of piezoelectric elements with insulating layers that include contact pads and wiring traces, allowing electronic components to be mounted directly on the insulating layer, eliminating the need for a separate printed circuit board and wiring, and using flexible layers for mounting support circuits on standard piezoelectric composites to facilitate energy harvesting and data processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If piezoelectric elements and support circuits are mounted separately on a substrate with wiring provided between them, then the system can be assembled using conventional methods, but the mounting and wiring process becomes complex and time-consuming
Solution Approach 1:
The patent merges the support circuit board and piezoelectric element mounting substrate into a single integrated substrate. The support circuits are directly mounted on the same substrate where piezoelectric elements are attached, eliminating the need for separate mounting processes and interconnecting wiring, thus simplifying the overall assembly process while reducing system complexity
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as both the mounting platform for piezoelectric elements and the support circuit board. This multi-functional design allows the same component to fulfill both mechanical mounting and electrical support roles, reducing the number of separate components needed
2Reliability
If a separate printed circuit board is used for support circuits, then circuit functionality is achieved, but the overall system size and component count increase
Solution Approach 1:
The support circuits and piezoelectric elements are integrated on a single substrate rather than using separate printed circuit boards. This consolidation maintains all necessary circuit functionalities while reducing the total component count and simplifying the overall system architecture
Solution Approach 2:
The substrate is designed with distinct regions for piezoelectric element mounting and support circuit placement, allowing functional segmentation while maintaining physical integration. This enables different components to be optimally positioned and connected without requiring separate boards
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the mounting process, reduces costs, and enhances energy harvesting efficiency while enabling efficient data processing and transmission, allowing for real-time structural health monitoring and condition-based maintenance.
Implementation Method 1
Piezoelectric elements are used as sensors, actuators, and energy harvesting devices. Vibration or strain in a workpiece can be sensed from the electricity the piezoelectric element produces.
Implementation Method 2
Alternatively, electricity from an external source can be provided to the piezoelectric element causing it to strain or vibrate.
Data Source
AI summary
A module includes a first piezoelectric element and first electronic device. The first piezoelectric provides physical support for said first electronic device. One embodiment includes a first insulating layer. The first insulating layer is mounted on the first piezoelectric element. The first electronic device is mounted on the first insulating layer for providing an electronic support function to the first piezoelectric element. In one embodiment the first electronic device includes a rectifier. One embodiment includes multiple contacts to the piezoelectric element each with its own rectifier. Another embodiment includes a stack of piezoelectric elements.