Integrated Piezoresistor Acceleration Sensor Design
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Solution Overview
Problem
Conventional acceleration sensors are difficult to downsize due to the independent placement of circuit, sensor, and weight components, which limits their miniaturization potential.
Innovation Solution
Integration of a semiconductor element, wiring layer, and piezoresistor on a single substrate, where the piezoresistor is formed as part of the wiring layer, allowing for the omission of a separate circuit chip and using a weight made from the wire protective film to apply stress to the piezoresistor, enabling downsizing and improved detection of small accelerations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the circuit chip, sensor chip, and weight are provided independently, then each component can be optimized separately, but the overall device size cannot be reduced
Solution Approach 1:
The patent combines the circuit chip, sensor chip, and weight into a single integrated sensor chip. The piezoresistor is formed directly on the substrate, eliminating the need for separate circuit and sensor chips. This integration maintains detection precision while significantly reducing the overall device volume.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the structural base, the piezoresistor formation layer, and the circuit integration platform. The wire protective film serves dual purposes as both electrical insulation and structural support for the weight, reducing the need for additional components.
2Adaptability or versatility
If multiple independent components are used, then functional separation is achieved, but manufacturing complexity increases
Solution Approach 1:
By merging the circuit and sensor functions into a single chip with the piezoresistor formed directly on the substrate, the patent reduces the number of assembly steps and interconnections required, thereby simplifying the manufacturing process while maintaining functional versatility.
Solution Approach 2:
The wire protective film automatically serves as the weight structure, eliminating the need for separate weight component manufacturing and assembly. The substrate itself provides both structural support and piezoresistor functionality, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design allows for a more compact acceleration sensor that can accurately detect accelerations in multiple directions, including small accelerations, while preventing excessive oscillation and potential damage to the piezoresistor.
Implementation Method 1
The piezoresistor is formed on the substrate and made up of a part of the wiring layer, and whose resistivity changes by the action of acceleration
Implementation Method 2
a weight made up of a part of the wire protective film located on the piezoresistor for applying stress to the piezoresistor by the action of acceleration
Data Source
AI summary
An acceleration sensor includes a semiconductor element built in a substrate, a wiring layer formed on the substrate, and a piezoresistor, formed on the substrate and made up of a part of the wiring layer, whose resistivity changes by the action of acceleration.