Integrated PIM and S-Parameter RF Test System
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Solution Overview
Problem
Existing RF testing systems face inefficiencies due to the need for sequential and manual connection of PIM and S-parameter test instruments, leading to slow testing processes and connector wear, and RF switches struggle to meet high power handling and low residual PIM requirements, limiting their use to niche applications.
Innovation Solution
A system that integrates a passive intermodulation test module with an in-line S-parameter test set using a reflectionless multiplexer, allowing for simultaneous and accurate wideband S-parameter testing without physical connection changes or RF switching, and includes a hybrid-coupled multiplexer for high output return loss across a wide bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sequential manual connection of PIM analyser and VNA is used, then cost is reduced, but testing speed decreases and connector wear increases
Solution Approach 1:
The patent combines the PIM analyser and VNA into a single integrated test instrument that can perform both PIM and S-parameter measurements simultaneously through a unified architecture, eliminating the need for separate instruments and manual reconnection while maintaining cost-effectiveness
Solution Approach 2:
The integrated test instrument is designed with multi-functional capabilities to perform both PIM analysis and S-parameter measurements through a single device with unified software control, replacing the need for separate specialised instruments
2Ease of manufacture
If sequential manual connection of PIM analyser and VNA is used, then cost is reduced, but connector wear increases
Solution Approach 1:
The patent combines the PIM analyser and VNA into a single integrated test instrument that can perform both PIM and S-parameter measurements simultaneously through a unified architecture, eliminating the need for separate instruments and manual reconnection while maintaining cost-effectiveness
Solution Approach 2:
The integrated instrument enables continuous testing operations without interruption for reconnection, maintaining constant contact between the test instrument and DUT connector, thereby eliminating mechanical wear from repeated connection and disconnection cycles
3Productivity
If RF switch is used for simultaneous connection, then testing speed increases, but cost increases and measurement accuracy decreases
Solution Approach 1:
The patent extracts and eliminates the RF switch component from the test system architecture, using direct simultaneous connections to both test instruments through a shared connector, thereby removing the source of residual PIM and reducing system cost while maintaining fast testing capability
Solution Approach 2:
The patent introduces a custom-designed connector assembly that serves as an intermediary component, enabling direct simultaneous connection of both PIM analyser and VNA to the DUT without requiring an RF switch, thereby maintaining low residual PIM and reducing overall system complexity
4Productivity
If RF switch is used for simultaneous connection, then testing speed increases, but measurement accuracy decreases
Solution Approach 1:
The patent extracts and eliminates the RF switch component from the test system architecture, using direct simultaneous connections to both test instruments through a shared connector, thereby removing the source of residual PIM and reducing system cost while maintaining fast testing capability
Solution Approach 2:
The patent introduces a custom-designed connector assembly that serves as an intermediary component, enabling direct simultaneous connection of both PIM analyser and VNA to the DUT without requiring an RF switch, thereby maintaining low residual PIM and reducing overall system complexity
Data Source
AI summary
A system for identifying faults in a radio frequency device under test, the system including a passive intermodulation test module, configured to perform passive intermodulation testing of the device under test on at least one test port; and an in-line S-parameter test set, coupled to the passive intermodulation test module and intermediate the passive intermodulation test module and at least one test port, and configured to perform wideband S-parameter testing of the device under test on the at least one test port.


