Integrated Pixel Modules for High-Resolution iLED Displays
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Solution Overview
Problem
Existing inorganic LED displays face challenges in achieving high-resolution and cost-effective manufacturability due to the difficulty in constructing displays with smaller iLEDs, which are typically controlled by external circuitry, leading to low pixel pitches and limited resolution compared to OLED or liquid crystal displays.
Innovation Solution
The integration of semiconductor substrates with native integrated circuits and non-native light emitters, connected via electrodes that extend through the substrate, allows for the formation of high-resolution pixel modules with improved manufacturability and reduced costs, utilizing micro-transfer printing techniques to assemble these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inorganic LEDs are made smaller to increase display resolution, then pixel pitch is reduced and resolution is improved, but manufacturing difficulty increases and cost increases
Solution Approach 1:
The display is divided into modular pixel modules, each containing a small number of iLEDs (e.g., 2-4 LEDs per module) along with integrated control circuitry. This segmentation allows each module to be manufactured and tested independently, then assembled into the complete display, thereby reducing the manufacturing complexity of individual components while achieving high overall resolution through the array of modules.
Solution Approach 2:
The patent combines multiple previously separate components into integrated pixel modules: iLEDs, control circuitry, and interconnect structures are merged into single functional units. This integration reduces the number of separate manufacturing steps and assembly operations, making production more efficient while maintaining high display resolution through the compact module design.
2Manufacturing precision
If inorganic LEDs are made smaller to increase display resolution, then pixel pitch is reduced and resolution is improved, but cost increases
Solution Approach 1:
By segmenting the display into reusable pixel modules, the patent enables standardized mass production of identical units. This standardization reduces per-unit costs through economies of scale in manufacturing, testing, and assembly, while the modular architecture allows high resolution to be achieved by simply increasing the number of modules rather than continuously shrinking individual LED size.
Solution Approach 2:
The modular pixel module design allows for easier testing, replacement, and potential reconfiguration of display sections. Defective modules can be identified and replaced individually without affecting the entire display, reducing waste and repair costs. The standardized module design also facilitates recovery and reuse of functional modules in different display configurations.
3Device complexity
If external circuitry is used to control each iLED, then device complexity is reduced, but pixel pitch increases and resolution decreases
Solution Approach 1:
The patent merges the control circuitry with the iLEDs within integrated pixel modules, placing the control electronics directly adjacent to or within the same module as the light-emitting elements. This integration eliminates the need for extensive external wiring and control structures, reducing pixel pitch by localizing control functions while maintaining manageable device complexity through modular design.
Solution Approach 2:
The patent transitions from planar control architecture to three-dimensional integrated structures, stacking control circuitry and iLEDs in vertical arrangements within pixel modules. This vertical integration reduces the horizontal space required for interconnects and control elements, enabling smaller pixel pitches while keeping control complexity manageable through layered organization.
Data Source
AI summary
An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.