Integrated Planar Fiber Shuffle for Multi-MCP Optical Routing
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Solution Overview
Problem
Existing optical data communication systems face challenges in achieving reliable and efficient modulation and reception of optical signals, particularly in integrating multiple photonic die and multi-chip packages (MCPs) without the need for external optical fiber shuffles, which can be costly and inefficient.
Innovation Solution
The integration of a planar optical fiber shuffle, implemented as a planar lightwave circuit, within a multi-MCP module assembly, which optically connects multiple photonic die and MCPs using optical fiber jumpers and alignment structures, eliminating the need for external shuffles and reducing costs and optical power loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external optical fiber shuffles are used to connect multiple photonic die and MCPs, then optical signal transmission is achieved, but system cost and optical power loss increase
Solution Approach 1:
The patent merges the optical fiber shuffle function directly into the planar lightwave circuit substrate, integrating multiple optical fiber connections and routing functions into a single integrated structure. This eliminates the need for separate external optical fiber shuffles, reducing connection interfaces and thereby reducing optical power loss while maintaining reliable signal transmission.
Solution Approach 2:
The patent introduces alignment structures as intermediary elements that facilitate precise coupling between optical fibers and the planar lightwave circuit. These alignment structures ensure optimal optical coupling efficiency, reducing power loss at connection interfaces while maintaining reliable signal transmission between multiple photonic die and MCPs.
2Reliability
If external optical fiber shuffles are used to connect multiple photonic die and MCPs, then optical signal transmission is achieved, but system complexity and cost increase
Solution Approach 1:
The patent combines multiple discrete components (optical fiber shuffle, connection interfaces, routing structures) into a single integrated planar lightwave circuit assembly. This integration reduces the number of separate components and interfaces, thereby reducing system complexity and cost while maintaining the functionality of optical signal transmission between multiple photonic die and MCPs.
3Ease of manufacture
If multiple photonic die and MCPs are integrated without external optical fiber shuffles, then system cost and compactness are improved, but integration precision and alignment are challenging
Solution Approach 1:
The patent introduces specialized alignment structures as intermediary elements that facilitate precise coupling between optical fibers and the planar lightwave circuit. These alignment structures provide mechanical guidance and positioning features that ensure accurate alignment during assembly, thereby achieving the required integration precision while maintaining cost-effectiveness and compactness.
Solution Approach 2:
The patent incorporates alignment features and positioning structures into the planar lightwave circuit design that are prepared in advance during manufacturing. These preliminary alignment features guide the assembly process and ensure precise integration of multiple photonic die and MCPs, reducing the need for complex post-assembly alignment procedures while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated optical fiber shuffle enables a more compact, cost-effective, and efficient optical data communication system by leveraging the semiconductor ecosystem, improving yield and reducing optical power loss while maintaining reliable signal transmission.
Implementation Method 1
The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle.
Implementation Method 2
a planar optical fiber shuffle, implemented as a planar lightwave circuit, within a multi-MCP module assembly, which optically connects multiple photonic die and MCPs
Data Source
AI summary
A multi-MCP (multi-chip package) module assembly includes a plate, an integrated optical fiber shuffle disposed on the plate, a first MCP disposed on the plate, a second MCP disposed on the plate, a first optical fiber jumper disposed on the plate, and a second optical fiber jumper disposed on the plate. The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle. The integrated optical fiber shuffle includes an optical network configured to direct optical signals to and from each of the first optical fiber jumper and the second optical fiber jumper.