Integrated Plating Apparatus for Sequential Multi-Metal Deposition
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Solution Overview
Problem
Conventional plating apparatuses require multiple units for different plating processes, leading to increased size, processing time, and reduced throughput due to sequential transfer of substrates between units, which also risks oxidation of the substrate surface.
Innovation Solution
A plating apparatus with a substrate rotating holder and multiple plating liquid supply units that perform different plating processes in sequence, utilizing a controller to manage the supply and drainage of plating liquids, and a substrate transfer unit to move the substrate between multi-plating and single-plating units, allowing for efficient and sequential processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate plating units are used for different plating processes, then each plating process can be performed with dedicated equipment, but the apparatus size increases and processing time increases due to sequential transfer
Solution Approach 1:
The patent combines multiple separate plating units (palladium plating unit, nickel plating unit, gold plating unit) into a single integrated plating unit. This integration allows multiple plating processes to be performed in sequence without transferring the substrate between separate units, thereby reducing processing time and increasing throughput while maintaining dedicated plating functionality through multiple plating liquid supply units within the same chamber.
Solution Approach 2:
The integrated plating unit is designed to perform multiple plating functions simultaneously by incorporating multiple plating liquid supply units (first plating liquid supply unit, second plating liquid supply unit, third plating liquid supply unit) that can supply different plating liquids (palladium, nickel, gold) to the substrate in sequence. This multi-functional design eliminates the need for separate dedicated units while maintaining process quality.
2Reliability
If multiple separate plating units are used for different plating processes, then each process has dedicated equipment, but the apparatus becomes scaled up in size
Solution Approach 1:
The patent merges multiple separate plating units into a single integrated plating unit, consolidating the space required for palladium plating, nickel plating, and gold plating into one chamber. This reduces the overall apparatus footprint while maintaining dedicated plating functionality through multiple plating liquid supply units that can operate in sequence within the same spatial envelope.
3Reliability
If substrate is transferred sequentially between multiple plating units, then each plating process can be performed independently, but processing time increases and substrate surface may oxidize
Solution Approach 1:
The patent combines multiple plating processes into a single integrated plating unit where the substrate remains in one location throughout the plating sequence. The multiple plating liquid supply units deliver different plating liquids in rapid succession without requiring substrate transfer, eliminating transfer time and reducing the risk of substrate surface oxidation between processes.
Solution Approach 2:
The integrated plating unit enables continuous plating operations by maintaining the substrate in a constant position while sequentially applying different plating liquids. This continuous action eliminates interruptions caused by substrate transfer between separate units, reducing total processing time and preventing substrate surface oxidation that occurs during transfer and waiting periods.
4Reliability
If multiple separate plating units are used, then each unit can be optimized for its specific process, but throughput is reduced due to sequential processing
Solution Approach 1:
The integrated plating unit incorporates multiple plating liquid supply units (first, second, and third plating liquid supply units) that can supply different plating liquids optimized for specific processes (palladium, nickel, gold plating) within a single chamber. This multi-functional design maintains process optimization while enabling sequential operations without substrate transfer, thereby increasing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus miniaturizes the plating process, reduces processing time, and prevents substrate oxidation by performing multiple plating processes in sequence, thereby improving throughput and efficiency.
Implementation Method 1
a substrate rotating holder configured to hold and rotate the substrate
Implementation Method 2
a multiple number of plating liquid supply units configured to supply different kinds of plating liquids onto the surface of the substrate
Implementation Method 3
a plating liquid drain unit disposed in a vicinity of the substrate rotating holder and configured to separate the plating liquids dispersed from the substrate depending on the kinds of the plating liquids and drain out the separated plating liquids
Data Source
AI summary
A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.