Integrated Power Converter Control Area for Semiconductor Chip
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Solution Overview
Problem
Current semiconductor chip power supply systems face challenges in achieving high frequency regulation at low cost, with high process precision for power converter control chips being costly and not matching the precision of semiconductor chips, leading to inefficiencies in power density and regulation speed.
Innovation Solution
Integrating a power converter control area with the semiconductor chip, allowing both data processing and power conversion functions to be formed on the same substrate, reducing component count and improving precision while maintaining low costs, and using a multi-phase paralleled buck circuit or switched capacitor circuit for power conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the process precision of the power converter control chip is increased to match the semiconductor chip precision (e.g., from 180 nm to 14 nm), then the regulation speed and power density improve, but the manufacturing cost increases significantly
Solution Approach 1:
The patent integrates the power converter control area directly into the semiconductor chip substrate, merging previously separate control and power stages into a unified structure. This integration enables the control area to utilize the same high-precision manufacturing process (e.g., 14 nm) as the semiconductor chip, achieving fast regulation speed without the need for a separate high-precision control chip, thus avoiding the high manufacturing costs associated with producing discrete high-precision control chips.
Solution Approach 2:
The semiconductor chip substrate is designed to perform multiple functions: it serves as both the processing unit and the control unit for the power converter. The control area within the chip handles power management tasks while the substrate itself provides the high-precision manufacturing benefits, eliminating the need for a dedicated control chip and reducing overall system cost while maintaining high regulation performance.
2Productivity
If the working frequency of the power converter power stage is increased from 500 KHz to 2 MHz or above 10 MHz, then the power density and regulation capability improve, but the process precision requirements increase leading to higher costs
Solution Approach 1:
By merging the power converter control area with the semiconductor chip, the system can operate at high frequencies (2 MHz to above 10 MHz) because the control logic resides on the same high-precision substrate as the power stage. This eliminates the bottleneck of using lower-precision external control chips, enabling the power converter to achieve high power density without compromising manufacturing feasibility.
3Device complexity
If an independent power converter control chip is used, then the system structure remains simple, but the size is small and market volume is insufficient to support high-cost high-precision semiconductor development
Solution Approach 1:
The patent combines the control area with the semiconductor chip into a single integrated unit, eliminating the need for a separate independent control chip. This integration ensures that the high-precision manufacturing capabilities (e.g., 14 nm process) are fully utilized within the chip itself, spreading the development cost across the entire chip production rather than requiring a separate high-volume market for control chips.
4Reliability
If the power converter control area is integrated with the semiconductor chip, then the system size is reduced and reliability is improved, but the component integration complexity increases
Solution Approach 1:
The integration of the control area with the semiconductor chip reduces the number of external components and interconnections, thereby improving reliability by eliminating potential failure points at interfaces. The control area is designed as an integrated block within the chip substrate, using the same manufacturing process and packaging, which simplifies the overall system architecture despite the increased integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-frequency regulation with reduced system size and improved reliability, achieving higher process precision for power converter control areas at lower costs, and supports higher working frequencies up to 1 GHz or more.
Implementation Method 1
a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area wherein the first power converter control area controls the first power converter power stage to supply power
Data Source
AI summary
The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area, and the first power converter control area adjusts the output voltage of the first power converter power stage according to information corresponding to a working status of the first data processing function area.