Integrated Power Converter Control Area for Semiconductor Chip
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Solution Overview
Problem
Current semiconductor chip power supply systems face challenges in achieving high frequency regulation at low cost, with high process precision for power converter control chips being costly and not aligned with the precision of semiconductor chips, leading to inefficiencies in power density and regulation capabilities.
Innovation Solution
Integrating a power converter control area with the semiconductor chip, allowing both data processing and power conversion functions on the same substrate, reducing component count and improving precision while maintaining a concise system structure, and enabling high-frequency operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the process precision of the power converter control chip is increased to match the semiconductor chip (e.g., from 180 nm to 14 nm), then the manufacturing precision and regulation capability are improved, but the cost increases significantly
Solution Approach 1:
The patent integrates the power converter control area directly into the semiconductor chip substrate, merging previously separate control chip and power stage components into a unified integrated structure. This eliminates the need for separate high-precision control chips manufactured at 180 nm, instead utilizing the chip's native 14 nm process for control functions, thereby achieving high manufacturing precision without the additional cost of separate high-precision control chip fabrication.
2Productivity
If the working frequency of the power converter power stage is increased from 500 KHz to 2 MHz or above 10 MHz, then the power density and regulation capability are improved, but the control precision and switching losses increase
Solution Approach 1:
By integrating the control area and power stage into a unified structure, the patent enables tightly coupled control and execution, allowing the control logic to directly drive the power switches with minimal latency. This integrated architecture supports high-frequency operation (2 MHz or above 10 MHz) while maintaining precise control, as the control signals travel shorter distances and experience less interference compared to separate chip configurations.
3Area of stationary object
If the power converter control chip is made smaller to reduce system size, then the integration density is improved, but the cost of high-precision semiconductor development becomes difficult to support
Solution Approach 1:
The patent consolidates the power converter control area and power stage onto a single semiconductor chip substrate, eliminating the need for a separate control chip. This integration reduces the overall system size while avoiding the high development costs associated with creating dedicated high-precision control chips, as the control functions utilize the same manufacturing process and infrastructure as the main semiconductor chip.
Solution Approach 2:
The integrated control area within the semiconductor chip serves multiple functions: it controls the power stage, processes sensor feedback, manages voltage regulation, and coordinates with other chip functions. This multi-functional design eliminates the need for separate specialized control chips, reducing both system size and development costs while maintaining comprehensive control capabilities.
4Device complexity
If the power converter control area is integrated with the semiconductor chip, then the system complexity is reduced and reliability is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent integrates the power converter control area directly into the semiconductor chip using the same 14 nm manufacturing process, creating a unified structure that reduces system complexity by eliminating separate control chips and interconnections. While this integration increases manufacturing process complexity, it leverages existing advanced semiconductor fabrication capabilities, allowing the control area and power stage to be manufactured simultaneously in the same process flow, thereby managing complexity through standardization rather than customization.
Data Source
AI summary
The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.