Integrated Power Converter Package on Lead Frame
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Solution Overview
Problem
Non-isolated dc-dc converters in telecommunication networks face challenges in reducing size and minimizing power losses due to parasitic inductance from PCB traces, especially at high switching frequencies, and lack flexibility in integration methods.
Innovation Solution
A power converter package structure that includes a semiconductor die mounted on a lead frame with integrated inductors, capacitors, and resistors, allowing for a high integration package with separate power and control components to reduce thermal stress and improve efficiency, and a method that embeds a buck converter or linear regulator within the semiconductor die to optimize the buck converter's form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If non-isolated dc-dc converters are implemented using conventional PCB trace connections, then the converter can be assembled with standard components, but parasitic inductance from PCB traces causes power losses especially at high switching frequencies
Solution Approach 1:
The patent merges the power converter components (semiconductor die, inductor, capacitors, resistors) onto a single lead frame substrate, creating an integrated power converter package. This consolidation eliminates the need for separate PCB trace connections between discrete components, thereby reducing parasitic inductance and associated power losses while maintaining assembly feasibility through standardized lead frame mounting techniques.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional integrated package structure where components are mounted on vertical surfaces and stacked arrangements on the lead frame. This dimensional change allows for shorter current paths and reduced loop areas, minimizing parasitic inductance without increasing the overall package footprint.
2Volume of moving object
If the size of dc-dc switching converter is reduced, then the form factor is improved, but thermal management becomes more challenging due to concentrated heat generation
Solution Approach 1:
The patent segments the power converter into functionally distinct components (power switching die, control die, passive components) that are separately mounted on the lead frame. This segmentation allows for strategic thermal management where heat-generating power components can be positioned for optimal heat dissipation, while control components are isolated in cooler regions, effectively managing thermal stress within the compact package.
Solution Approach 2:
The lead frame serves as a thermal intermediary, providing thermal pathways from heat-generating components to external heat sinks. The lead frame's metallic construction and extended geometry act as a heat spreader, distributing concentrated heat from small power components across a larger surface area, thereby reducing peak temperatures while maintaining compact converter size.
3Volume of moving object
If power and control components are integrated into a single package, then the overall converter size is reduced, but thermal stress between power and control components increases
Solution Approach 1:
The patent applies local quality by creating distinct thermal zones within the integrated package. Power components are positioned in regions with enhanced thermal pathways to heat sinks, while control components are located in regions with reduced thermal exposure. The lead frame design incorporates localized thermal vias and heat spreaders under power components, providing tailored thermal management for each functional region while maintaining compact integration.
Data Source
AI summary
An embodiment power converter package comprises a semiconductor die, an output inductor, a plurality of input capacitors and output capacitors. The semiconductor die, the output inductor and the plurality of capacitors are mounted on a lead frame and connected one to another through various pads on the lead frame. The semiconductor die comprises a high side switch, a low side switch and a driver. The power converter package is electrically coupled to an external pulse width modulation controller through a variety of input and output pads.