Integrated Power Device with Shared Heat-Sink
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power devices for switching circuits are inefficient in terms of area occupation, constructive complexity, and heat dissipation, as they typically require separate chips for each power transistor and external heat-sinks, leading to increased size and complexity.
Innovation Solution
A power device design that integrates two power transistors in series within a single package, with a shared heat-sink and conductive leads for efficient heat dissipation, reducing the need for external heat-sinks and minimizing area occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate chips are used for each power transistor with external heat-sinks, then each transistor can be independently controlled and manufactured, but the area occupation increases and constructive complexity increases
Solution Approach 1:
The patent merges two separate power transistor chips into a single integrated package with a shared heat-sink. The first and second power transistors are mounted on opposite sides of the same heat-sink structure, allowing independent electrical control while sharing common thermal management infrastructure, thereby reducing overall area occupation and constructive complexity.
Solution Approach 2:
The shared heat-sink structure serves multiple functions simultaneously: it acts as a thermal management component for both transistors, provides mechanical support for mounting both chips, and serves as an electrical isolation barrier between the two transistor circuits. This multi-functionality reduces the need for separate components.
2Adaptability or versatility
If separate chips are used for each power transistor with external heat-sinks, then each transistor can be independently controlled and manufactured, but the device complexity increases
Solution Approach 1:
The patent combines multiple discrete components (two transistor chips, two separate heat-sinks, mounting hardware) into a single integrated power device package. The shared heat-sink structure integrates thermal management for both transistors, reducing the number of separate components and simplifying the overall device construction.
Solution Approach 2:
The heat-sink structure performs multiple functions: thermal dissipation for both transistors, mechanical support for chip mounting, and electrical isolation between circuits. This consolidation of functions into a single component reduces constructive complexity.
3Temperature
If external heat-sinks are used for each power transistor, then adequate heat dissipation can be achieved, but the form factor increases and manufacturing complexity increases
Solution Approach 1:
The patent merges two separate heat-sink structures into a single shared heat-sink that serves both power transistors. The heat-sink is positioned between the first and second chips, with thermal contact to both transistors, providing adequate heat dissipation while reducing the overall volume and form factor compared to two separate heat-sink assemblies.
4Ease of repair
If separate power devices are mounted on PCB for switching circuits, then each device can be independently replaced and tested, but the area occupation and constructive complexity increase
Solution Approach 1:
The patent creates a single integrated power device package containing two power transistors that can be used in switching circuits. This integrated unit reduces the number of separate components that need to be mounted and connected on the PCB, thereby reducing area occupation while maintaining the ability to replace the entire unit as a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables compact, efficient heat dissipation and reduced complexity, allowing for smaller form factor and improved reliability in switching circuits with enhanced durability and reduced power losses.
Implementation Method 1
a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip
Data Source
AI summary
A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.