Integrated Power Electronics Assembly Module Vertical Stacking
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Solution Overview
Problem
Power conversion circuits are often specific to certain operating conditions, limiting their portability and flexibility, and can damage switching devices due to voltage spikes during transient periods, affecting the overall system device design and application.
Innovation Solution
An integrated power electronics assembly module with a vertically stacked configuration, where the clamping auxiliary circuit board is positioned close to the power unit to reduce parasitic inductance and voltage spikes, and is electrically coupled to the power level circuit board via a shielding casing, enhancing protection and portability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power conversion circuit is designed with strong specificity for certain operating conditions, then the performance for those conditions is optimized, but the portability and flexibility of the circuit are reduced
Solution Approach 1:
The power conversion circuit is divided into modular components: a power conversion module containing switching devices and passive components, a control module, and a clamping auxiliary circuit module. Each module can be independently designed, tested, and replaced, allowing the system to maintain optimized performance for specific operating conditions while enabling flexibility through modular reconfiguration.
Solution Approach 2:
The patent transitions from planar circuit layout to a three-dimensional stacked configuration where the clamping auxiliary circuit board is vertically positioned near the power conversion module. This vertical stacking reduces parasitic inductance and allows multiple functional layers to coexist, improving both performance and adaptability without increasing footprint.
2Ease of manufacture
If the clamping auxiliary circuit board is positioned far from the power unit, then the system board design is simplified, but voltage spikes during switching can damage the switching devices
Solution Approach 1:
The clamping auxiliary circuit board is positioned in the vertical dimension close to the power conversion module rather than being placed far away in the horizontal plane. This vertical stacking reduces the loop area and parasitic inductance between the power switches and clamping circuit, effectively suppressing voltage spikes while maintaining manufacturing simplicity through standardized vertical mounting processes.
Solution Approach 2:
The clamping auxiliary circuit is locally positioned only where needed - immediately adjacent to the power conversion module that generates voltage spikes. This localized placement provides targeted protection exactly where the harmful electrical transients occur, without requiring comprehensive redesign of the entire system board.
3Quantity of substance
If the power electronics assembly module has a large footprint, then all necessary components can be included, but the portability of the module is reduced
Solution Approach 1:
The patent employs vertical stacking to arrange multiple circuit boards (power conversion module, control board, clamping auxiliary circuit board) in the vertical dimension rather than spreading them out horizontally. This three-dimensional configuration consolidates all necessary components into a compact vertical assembly, reducing the horizontal footprint while maintaining full functionality and improving module portability.
Solution Approach 2:
The design nests multiple functional modules within a compact vertical structure, where the clamping auxiliary circuit board is positioned within the vertical space adjacent to the power conversion module. This nested arrangement maximizes component density while minimizing overall module dimensions, enhancing portability without sacrificing component inclusion.
Data Source
Figure 1
Figure 2A~3C
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AI summary
An integrated power electronics assembly module includes a power unit and a clamping auxiliary circuit board. The power unit includes a power level circuit board and a shielding casing. The power level circuit board is contained in the shielding casing. The clamping auxiliary circuit board is disposed against the shielding casing and stacked with the power level circuit board to reduce a parasitic inductance generated by a commutation loop constituted by the power level circuit board and the clamping auxiliary circuit board. The clamping auxiliary circuit board is electrically coupled to the power level circuit board via the shielding casing.