Integrated Power Module Package for Multi-Phase Inverter and PFC

Solution Overview

Problem

Traditional voltage regulators with power factor correction (PFC) and multi-phase inverters are housed in separate packages, leading to increased complexity, larger footprint, and reduced performance.

Innovation Solution

Integration of a power module package that combines a multi-phase inverter and PFC circuit within a single package, utilizing a common driver IC to drive both, which simplifies interconnects and reduces size while maintaining high functionality and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If PFC circuit and multi-phase inverter are housed in separate packages, then ease of manufacture is improved, but device complexity and footprint increase

Engineering Contradiction:

Improveease of manufactureVSAvoiddevice complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines the PFC circuit and multi-phase inverter into a single integrated power module package, merging previously separate components into one unified device. This integration reduces the number of discrete packages and interconnections, thereby reducing device complexity and footprint while maintaining ease of manufacture through standardized integrated packaging.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If PFC circuit and multi-phase inverter are housed in separate packages, then ease of manufacture is improved, but footprint increases

Engineering Contradiction:

Improveease of manufactureVSAvoidfootprint

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent combines the PFC circuit and multi-phase inverter into a single integrated power module package, merging previously separate components into one unified device. This integration reduces the number of discrete packages and interconnections, thereby reducing device complexity and footprint while maintaining ease of manufacture through standardized integrated packaging.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If PFC circuit and multi-phase inverter are housed in separate packages, then manufacturing simplicity is improved, but performance is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidperformance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent combines the PFC circuit and multi-phase inverter into a single integrated power module package, merging previously separate components into one unified device. This integration reduces the number of discrete packages and interconnections, thereby reducing device complexity and footprint while maintaining ease of manufacture through standardized integrated packaging.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10122293B2Power module package having a multi-phase inverter and power factor correction

Publication Date: 2018.11.06 INFINEON TECHNOLOGIES AMERICAS CORP

AI summary

According to an exemplary implementation, a power module package includes a multi-phase inverter. The power module package also includes a multi-phase inverter driver configured to drive the multi-phase inverter. The power module package further includes a power factor correction (PFC) circuit where the PFC circuit is configured to regulate a bus voltage of the multi-phase inverter and a PFC driver configured to drive the PFC circuit. The multi-phase inverter, the multi-phase inverter driver, the PFC circuit, and the PFC driver are situated on a package substrate of the power module package. The multi-phase inverter driver and the PFC driver can be in a common driver integrated circuit (IC).