Integrated Power Module Layout for Compact Isolated Conversion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional power converter systems are large and complex due to the need for multiple power modules, which can be undesirable for certain applications.
Innovation Solution
A power module design that integrates power semiconductor die to form both an active front-end and a switching power converter, with conductive traces and connector pins arranged to ensure a compact footprint and improved reliability, while maintaining safety and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate power modules are used to provide both active front-end and switching power converter functions, then system reliability and functional separation are improved, but system size and complexity increase
Solution Approach 1:
The patent combines both active front-end and switching power converter functions into a single integrated power module, merging previously separate modules. This integration reduces the overall system complexity and size while maintaining the functional separation and reliability through careful internal design of the module.
Solution Approach 2:
The power module is designed with multi-functionality, where a single module can provide both active front-end and switching power converter functions. The connector pins and conductive traces are configured to support multiple topological configurations, allowing the same physical module to serve different functional roles.
2Area of stationary object
If connector pins are placed close together to reduce footprint, then module size is reduced, but voltage isolation and reliability deteriorate
Solution Approach 1:
The patent applies different spatial arrangements to different connector pins based on their voltage requirements. High-voltage connector pins are positioned with greater separation distances to maintain proper voltage isolation, while low-voltage pins can be placed closer together. This local differentiation optimizes both footprint and reliability.
Solution Approach 2:
The connector pins are arranged in a three-dimensional configuration on the substrate, utilizing vertical spacing and layered routing to achieve voltage isolation without proportionally increasing the planar footprint. This dimensional approach allows compact packaging while maintaining necessary clearance distances.
3Ease of manufacture
If standard power module configurations are used, then manufacturing and interchangeability are improved, but system adaptability and compactness deteriorate
Solution Approach 1:
The power module incorporates reconfigurable connectivity through selectively connectable connector pins, allowing the same physical module to be dynamically configured for different topological requirements. This dynamic adaptability enables the module to serve multiple applications while maintaining standardized manufacturing processes.
Data Source
AI summary
A power module includes a power substrate, a number of power semiconductor die, and a number of connector pins. The power substrate includes a number of conductive traces. The power semiconductor die are mounted on the power substrate and electrically coupled to the conductive traces. The connector pins are each electrically coupled to a different one of the conductive traces and configured to be interconnected such that the power semiconductor die provide an active front-end and a switching power converter. By providing the power semiconductor die such that they can be interconnected to form an active front-end and a switching power converter in the same power module, the power module may provide a significantly more compact power converter system using both an active front-end and switching power converter.