Integrated Power Module Packaging Structure for High-Density Inverters
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Solution Overview
Problem
Conventional power module packaging structures are bulky and difficult to miniaturize, hindering the development of high-power, high-density inverters used in automation and motor applications.
Innovation Solution
An integrated power module packaging structure featuring a three-dimensional stacking of a driving device and power device within a plastic housing, utilizing step-shaped pins and multiple printed circuit boards connected via bonding wires and a heat dissipation component to optimize space usage and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power device and driving device are separated in conventional inverter design, then each device can be independently designed and manufactured, but the overall size and weight of the inverter cannot be minimized
Solution Approach 1:
The patent merges the power device and driving device into a single integrated power module packaging structure. The power device is mounted on the first printed circuit board while the driving device is mounted on the second printed circuit board, and both are integrated within the same plastic housing with shared thermal dissipation fins. This merging eliminates the need for separate housings and reduces overall inverter volume while maintaining independent functionality of each device.
Solution Approach 2:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The first and second printed circuit boards are disposed at different heights within the plastic housing, with the second PCB positioned above the first PCB. This vertical stacking utilizes the third dimension (height) to reduce the footprint area while maintaining adequate spacing for thermal management and electrical isolation.
2Productivity
If power device and driving device are integrated in three-dimensional stacking structure, then space is saved and volume is reduced, but manufacturing and assembly complexity increases
Solution Approach 1:
The patent incorporates step-shaped pins during the injection molding process of the plastic housing. These pins are pre-formed with specific bending portions that will later serve as electrical connection terminals. By creating these connection structures during the housing manufacturing process rather than as separate components, the patent reduces the number of assembly steps required while ensuring precise positioning and electrical connectivity between the power device, driving device, and external circuits.
Solution Approach 2:
The plastic housing serves multiple functions simultaneously: it provides mechanical protection for the internal components, acts as a thermal management structure through integrated fins, and provides electrical connection interfaces through the embedded step-shaped pins. This multi-functionality reduces the total component count and simplifies the overall manufacturing process while achieving high space utilization through the compact three-dimensional layout.
3Adaptability or versatility
If step-shaped pins with L-shaped bending portions are used for electrical connection, then flexible interconnection is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The step-shaped pins are pre-formed during the injection molding process with precise L-shaped bending portions. The bending radius, bending angle, and position of these pins are controlled during mold design and manufacturing, ensuring consistent electrical connection geometry. This preliminary formation during housing manufacturing eliminates the need for subsequent bending operations and ensures high manufacturing precision through mold-controlled geometry.
Solution Approach 2:
The L-shaped bending portions of the step-shaped pins are designed to automatically align and make electrical contact with corresponding pads on the printed circuit boards during the assembly process. The elastic properties of the bent portions allow them to self-adjust to minor positioning variations, providing tolerance compensation without requiring high-precision manual adjustment. This self-aligning feature reduces assembly complexity while maintaining reliable electrical connections.
Data Source
AI summary
An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.