Integrated Power Module Packaging Structure for High Density
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Solution Overview
Problem
Conventional integrated power modules are bulky and heavy due to the need for additional isolation configurations for detection devices, which hinders their miniaturization and high-density packaging, especially for applications requiring high power and speed control.
Innovation Solution
A three-dimensional stacked packaging structure that integrates a switching module, high side current/voltage detecting device, and driving device on multiple circuit boards within a housing, reducing the overall volume and noise interference by minimizing trace lengths between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional isolation configuration is added for detection devices, then detection reliability is improved, but the size and weight of the inverter increase
Solution Approach 1:
The patent combines the detection device, driving device, and switching module into a single integrated power module packaging structure. The detection device and driving device are mounted on the same circuit board as the switching module, eliminating the need for separate isolation configurations and reducing overall inverter size while maintaining detection reliability through integrated signal routing via pins.
Solution Approach 2:
The integrated power module serves multiple functions within a single packaging structure: it houses the switching module for power conversion, the detection device for voltage/current monitoring, and the driving device for control signals. This multi-functional integration reduces the number of separate components needed, thereby reducing inverter size and weight.
2Reliability
If additional isolation configuration is added for detection devices, then detection reliability is improved, but the weight of the inverter increases
Solution Approach 1:
The detection device, driving device, and switching module are merged into a single integrated packaging structure, eliminating redundant isolation configurations and reducing the overall weight of the inverter while maintaining detection reliability through integrated signal routing.
Solution Approach 2:
The integrated power module provides multiple functions (power switching, detection, and control) within a single lightweight packaging structure, reducing the total weight compared to separate isolated components.
3Ease of manufacture
If conventional integrated power module structure is used, then manufacturing simplicity is maintained, but element density is low
Solution Approach 1:
The patent transitions from a conventional planar layout to a three-dimensional stacked packaging structure. The detection device and driving device are positioned on layers above or below the switching module, connected via vertical pin structures. This dimensional change increases element density while maintaining manufacturing simplicity through standardized stacking and connection processes.
Data Source
AI summary
An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.