Integrated Power Module with TSV Contacts for Semiconductor Packaging
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Solution Overview
Problem
Integrating diverse circuit elements into a single chip or package is challenging due to differing power requirements, leading to inefficient power consumption and increased space usage with long power supply lines and voltage regulators.
Innovation Solution
Incorporating a power module with through silicon via (TSV) contacts to directly supply power to the die or dies, reducing the need for long power supply lines and voltage regulators, and enabling a more compact design compatible with 2.5D and 3D IC packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long power supply lines and voltage regulators are used to provide power to different devices, then power supply coverage is improved, but power consumption and chip/package space increase
Solution Approach 1:
The invention divides the power supply system into multiple independent power modules, each serving specific devices or circuit blocks. Instead of using a single centralized power supply with long distribution lines, the power supply function is segmented into discrete modules placed close to the devices they serve, eliminating the need for extensive power distribution networks while reducing overall power consumption.
2Reliability
If long power supply lines and voltage regulators are used to provide power to different devices, then power supply coverage is improved, but chip/package space increases
Solution Approach 1:
The power supply system is segmented into multiple compact modules distributed across the chip or package. Each module serves a localized area, eliminating the need for long power supply lines that would consume significant space. The segmented approach allows for more efficient space utilization while maintaining comprehensive power supply coverage.
Solution Approach 2:
The invention transitions from a planar power distribution approach to a three-dimensional configuration by stacking power modules vertically or arranging them in multiple layers. This dimensional change allows power modules to be positioned close to devices without increasing the lateral footprint of the chip or package, effectively reducing the area occupied by power supply infrastructure.
3Adaptability or versatility
If additional voltage regulators or charge pumps are employed to cater for different circuits, then different power requirements are met, but device complexity increases
Solution Approach 1:
The power modules are designed with universal functionality to handle multiple types of power requirements. Each module can operate as a voltage regulator, charge pump, or other power management function depending on the specific needs of the connected devices. This multi-functionality reduces the need for specialized components for each circuit type, thereby simplifying the overall device complexity while maintaining adaptability to different power requirements.
Data Source
AI summary
Semiconductor devices and methods for forming a semiconductor device are disclosed. The semiconductor device includes a die. The die includes a die substrate having first and second major surfaces. The semiconductor device includes a power module disposed below the second major surface of the die substrate. The power module is electrically coupled to the die through silicon via (TSV) contacts.