Integrated Power Module Vibration Resistance
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Solution Overview
Problem
Conventional power modules have a separated power circuit and gate driver circuit, leading to increased size, limited application range, high failure rates due to vibration, and complex, costly manufacturing processes.
Innovation Solution
An integrated power module design that combines the power circuit and gate driver circuit within a compact structure using parallel metal plates and an annular frame, with components and metal traces firmly fixed to prevent vibration-induced failures, and an electrical-isolation thermal-dissipation pad for simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power circuit and gate driver circuit are separated, then each circuit can be independently designed and manufactured, but the overall module size increases and application range is limited
Solution Approach 1:
The patent combines the power circuit and gate driver circuit into a single integrated module. The gate driver circuit is directly mounted on the same substrate as the power circuit, eliminating the need for separate packaging structures and reducing overall module size while maintaining independent design capabilities for each circuit block.
Solution Approach 2:
The patent utilizes three-dimensional space arrangement by stacking components vertically. The gate driver circuit is positioned above the substrate at specific locations, allowing electrical connection through vertical vias and conductive structures, thereby reducing horizontal footprint and overall module volume.
2Ease of manufacture
If conventional packaging structures are used with separate circuits, then manufacturing is straightforward, but the module size significantly increases
Solution Approach 1:
The patent employs a unified packaging structure where both the power circuit and gate driver circuit share the same substrate and housing. This integrated packaging eliminates redundant structural elements and reduces the overall module volume while simplifying the packaging process.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the power circuit, mounts the gate driver circuit, provides electrical connection paths, and acts as a heat dissipation structure. This multi-functionality reduces the need for additional components and reduces overall module size.
3Reliability
If multiple signal buses are used to electrically couple power circuit and external gate driver circuit, then electrical connection is achieved, but the module size increases
Solution Approach 1:
The patent transitions from horizontal signal bus routing to vertical electrical connection. The gate driver circuit is positioned above the substrate and connects to the power circuit through vertical vias and conductive structures, significantly reducing the horizontal space required for signal transmission.
Solution Approach 2:
The electrical connection is divided into multiple segments: connection pads on the substrate, vertical vias through the substrate, and contact pads on the gate driver circuit. This segmented approach allows for compact routing and reduces the overall connection path length and space requirements.
4Ease of manufacture
If components are not firmly fixed, then assembly is simple, but chips and signal buses tend to drop off due to vibration in serious vibration environments
Solution Approach 1:
The gate driver circuit is pre-positioned and firmly fixed to the substrate at specific locations before final assembly. This preliminary fixation ensures that components are securely attached before the module is subjected to vibration, preventing detachment during operation.
Solution Approach 2:
The patent employs annular frames and curved mounting structures that provide enhanced mechanical bonding. The annular frame structure distributes mechanical stress evenly and provides superior vibration resistance compared to flat mounting surfaces.
5Reliability
If thermal-dissipation paste and electrical-isolation paste are used separately, then proper thermal and electrical isolation is achieved, but the manufacturing process becomes very complicated requiring more time and manpower
Solution Approach 1:
The patent uses a composite structure where the substrate itself provides both electrical isolation and thermal dissipation functions. The substrate material is designed with appropriate electrical resistivity for isolation and high thermal conductivity for heat dissipation, eliminating the need for separate paste applications.
Solution Approach 2:
The substrate serves dual functions: it provides electrical isolation between different circuit blocks through its inherent resistivity, and simultaneously provides thermal dissipation pathways through its high thermal conductivity. This multi-functionality simplifies the manufacturing process by eliminating separate steps for applying thermal and electrical isolation pastes.
Data Source
AI summary
An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second metal plates, and an annular frame. The first metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; at least one of the first metal plates may include a plurality of chip slots. The chips may be disposed at the chip slots; each of the chips may be electrically coupled to one of the adjacent first metal plates. The second metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; each of the second metal plates may be disposed between any two adjacent first metal plates. The first metal plates, the second metal plates, the gate driver circuit, and the chips may be disposed inside the annular frame.