Integrated Power Regulating Circuit for Electronic Device Miniaturization
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Solution Overview
Problem
High-performance computing systems require power supply units with low power consumption and high heat dissipation, but existing designs are constrained by the need to minimize electromagnetic interference, leading to increased size and limited miniaturization due to the complexity of power routing paths and varying voltage requirements across multiple dies.
Innovation Solution
The integration of power regulating circuits and interconnection circuits within a semiconductor die reduces the size of the electronic device by providing efficient power distribution and signal transmission paths, minimizing voltage drop and power loss, while optimizing the layout to separate power and signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power routing paths are provided through system board with separate power regulating components, then power distribution is achieved, but device size increases and miniaturization is limited
Solution Approach 1:
The patent merges the power regulating component and the interconnection structure into a single integrated component. The power regulating component is formed directly over the interconnection structure, eliminating the need for separate power routing paths on the system board. This integration reduces device size while maintaining power distribution functionality.
Solution Approach 2:
The patent transitions from a planar power routing approach on the system board to a vertical stacking architecture. The power regulating component is positioned directly over the interconnection structure in the vertical dimension, allowing power and signal paths to overlap spatially. This dimensional change enables miniaturization by utilizing the third dimension for routing.
2Reliability
If power regulating components are provided over interconnection structure, then power distribution is improved, but device size increases
Solution Approach 1:
The power regulating component and interconnection structure are merged into a single integrated unit. The power regulating component is formed directly over the interconnection structure, creating a compact assembly that improves power routing stability while minimizing device size. The integration eliminates gaps and reduces the overall footprint.
Solution Approach 2:
The power regulating component is nested directly over the interconnection structure, with the two components occupying overlapping spatial regions. This nesting arrangement allows the power routing function to be embedded within the interconnection structure's footprint, improving reliability without increasing device size.
3Object-affected harmful factors
If separate power and signal paths are provided on system board, then electromagnetic interference is minimized, but layout flexibility is constrained
Solution Approach 1:
The patent uses vertical stacking to separate power and signal paths in the vertical dimension rather than requiring horizontal separation on the system board. The power regulating component is positioned directly over the interconnection structure, allowing power paths to extend vertically through the stacked architecture while signal paths remain on the interconnection structure. This dimensional separation maintains electromagnetic isolation while providing layout flexibility.
Solution Approach 2:
The interconnection structure serves as an intermediary between the power regulating component and the processing die. It provides dedicated signal routing paths that are electrically isolated from the power paths in the power regulating component above. This intermediary structure enables electromagnetic interference minimization while maintaining layout flexibility through its positioning and routing capabilities.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a circuit structure. The circuit structure is supported by the first electronic component and the second electronic component. The circuit structure electrically connects the first electronic component to the second electronic component and is configured to provide the first electronic component and the second electronic component with a power.