Integrated Power Supply Die for Low-Voltage Track Routing
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Solution Overview
Problem
Current power supply systems face inefficiencies in power transmission due to shrinking device dimensions and decreasing device voltage, leading to increased power consumption, system size, cost, and weight, as well as limitations in the number of supported voltage tracks.
Innovation Solution
A packaging device for an integrated power supply system utilizing a three-dimensional chip stacking technology, where a power supply system die with an active and passive module, and a rewiring layer is integrated below a power consumption system die, providing multiple low-voltage power supply tracks through μ-bumps, thereby improving power transmission efficiency and reducing parasitic resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more power supply tracks are added to support more devices, then the number of supported voltage supplies increases, but the system volume, cost and weight increase
Solution Approach 1:
The patent combines multiple power supply tracks and voltage regulation functions into a single integrated power supply die. This die integrates multiple DC-DC converters and voltage regulators that can simultaneously provide multiple different voltages (e.g., 1.8V, 3.3V, 5V) to multiple devices, replacing what would traditionally require separate power supply components for each voltage track.
Solution Approach 2:
The integrated power supply die is designed to perform multiple functions simultaneously - it can provide multiple different voltage levels, support multiple devices, and adapt to different power supply configurations. A single die can serve as both a voltage regulator and a power management unit, providing universal power supply capability across multiple voltage tracks.
2Adaptability or versatility
If more power supply components are copied to add power supply tracks, then the number of elements increases, but the device complexity increases
Solution Approach 1:
The patent merges multiple discrete power supply components (DC-DC converters, voltage regulators, control circuits) into a single integrated power supply die. This consolidation reduces the total number of components while maintaining the capability to provide multiple power supply tracks with different voltage levels.
Solution Approach 2:
The integrated power supply die employs a nested structure where multiple functional blocks (voltage regulators, converters, control units) are embedded within a single die package. Each functional block is nested within the overall die structure, allowing multiple power supply functions to coexist in a compact, organized manner without requiring separate discrete components.
3Ease of manufacture
If the package size is increased to accommodate wire spacing and wire width requirements, then the rewiring layer can be implemented, but the system volume increases
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked architecture. The integrated power supply die is positioned vertically below the power consumption system die, with rewiring layers connecting them in the vertical dimension. This allows multiple power supply tracks to be routed through the vertical stack rather than requiring extensive lateral wire spacing on a single plane.
Solution Approach 2:
The rewiring layer acts as an intermediary structure that facilitates electrical connection between the integrated power supply die and the power consumption system die. This intermediate layer enables compact routing of multiple power supply tracks through controlled vias and conductive paths, reducing the need for large lateral wire spacing while maintaining manufacturability.
4Manufacturing precision
If critical dimensions are shrunk and device voltage is decreased, then device integration is improved, but power transmission efficiency is reduced
Solution Approach 1:
The patent replaces traditional mechanical/electrical power transmission through wire bonds and PCB traces with direct die-to-die electrical contact through integrated rewiring layers. This substitution eliminates the parasitic resistance and inductance associated with external wiring, significantly improving power transmission efficiency despite reduced voltage and smaller dimensions.
Solution Approach 2:
The integrated rewiring layer serves as an intermediary transmission medium that provides low-resistance electrical pathways between the power supply die and power consumption die. This intermediate structure minimizes power loss during transmission by providing optimized conductive paths with reduced parasitic effects compared to traditional wire bonding or PCB routing.
Data Source
AI summary
The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.