Integrated Pressure Sensor Assembly Without Wire Connections

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Solution Overview

Problem

Conventional pressure sensors have a large size and poor reliability due to the separation of pressure sensitive components and control circuits, requiring wire connections and separate housings, which complicates assembly and increases volume.

Innovation Solution

Integration of pressure sensitive elements and signal generators on a common substrate, with integrated seals and a compact housing design that eliminates wire connections and includes multiple seals to isolate the components from the ambient environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pressure sensitive component and control circuit are separated and connected through wire connection, then reliability is improved through isolation, but device volume and overall size increase significantly

Engineering Contradiction:
ImprovereliabilityVSAvoidoverall size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent integrates the pressure sensitive component and control circuit onto a single substrate, eliminating the need for wire connections and separate housings. This merging of previously separated components directly reduces device volume while maintaining functional isolation through the substrate structure, resolving the contradiction between reliability through isolation and compact size.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If pressure sensitive component and control circuit are separated into different housings, then reliability is improved through isolation, but device complexity and assembly difficulty increase

Engineering Contradiction:
ImprovereliabilityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By combining both components on a single substrate with integrated sealing structures, the patent eliminates the need for separate housings and complex wire connections. This integration simplifies the overall device structure and assembly process while maintaining the reliability benefits of isolated component operation through the substrate's inherent separation capabilities.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If wire connections are used to connect pressure sensitive component and control circuit, then reliability is improved through electrical connection, but manufacturing complexity and assembly time increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidassembly speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the mechanical wire connection system with a direct substrate-based electrical connection. The substrate serves as both the mechanical support and electrical pathway, eliminating the need for separate wire connections and associated assembly steps. This substitution maintains reliable electrical connectivity while significantly improving manufacturing efficiency and assembly speed.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentEP4235133B1Pressure sensor assembly and method for manufacturing a pressure sensor assembly
Publication Date: 2026.04.15 THERM O DISC INC
  • EP4235133B1 patent drawingFigure 1
  • EP4235133B1 patent drawingFigure 2
  • EP4235133B1 patent drawingFigure 3

AI summary

A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed.