Integrated Pressure Sensor in Display Module
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Solution Overview
Problem
Mechanical keys on electronic devices are prone to wear and failure over time, and external pressure sensors, while offering a solution, face reliability issues due to limited space constraints and inconsistent assembly, leading to potential detachment during drops and increased costs.
Innovation Solution
Integrating a pressure sensor with pressure-sensitive resistors made of the same material as the semiconductor active layer within the display module's layered structure, eliminating the need for glue and enhancing product integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external pressure sensor is installed separately and fastened with glue material, then the pressure sensing function is achieved, but the reliability deteriorates due to potential detachment during drops and assembly inconsistencies
Solution Approach 1:
The pressure sensor is merged with the display module by integrating the pressure-sensitive resistor into the same semiconductor active layer. This combining eliminates the need for separate attachment with glue material, thereby improving reliability by preventing detachment and reducing assembly complexity.
Solution Approach 2:
The semiconductor active layer serves dual functions: as the functional layer for the display module and as the material layer for the pressure-sensitive resistor. This multi-functionality eliminates the need for separate pressure sensor components and attachment materials, improving both reliability and simplifying assembly.
2Reliability
If a mechanical key is used on the electronic device, then the control function is achieved, but the reliability deteriorates due to mechanical wear and potential failure over time
Solution Approach 1:
The mechanical key system is replaced with a pressure sensor-based detection system. The pressure-sensitive resistor detects pressing actions through electrical resistance changes rather than mechanical movement, eliminating mechanical wear and improving durability while allowing for a flush design without protruding keys.
3Reliability
If an external pressure sensor is installed separately, then the pressure sensing function is achieved, but the manufacturing cost increases due to additional assembly steps and materials
Solution Approach 1:
The pressure sensor is merged into the display module's manufacturing process by forming the pressure-sensitive resistor in the same semiconductor active layer. This eliminates separate assembly steps and glue material requirements, improving assembly consistency while reducing manufacturing costs.
Solution Approach 2:
The semiconductor active layer serves dual purposes as both the display module functional layer and the pressure sensor material layer. This multi-functionality eliminates the need for separate pressure sensor components and attachment materials, improving assembly consistency while reducing manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration improves the reliability and consistency of electronic devices by synchronously forming pressure sensors during manufacturing without using glue, reducing the risk of detachment and assembly inconsistencies, while also saving space and reducing costs.
Implementation Method 1
The semiconductor active layer has a pressure-sensitive feature, namely, a feature of changing resistance after being pressed
Data Source
AI summary
A display module, an electronic device, and an electronic device control method, and relate to the field of display technologies. A pressure sensor is integrated into a layered structure of the display module. The display module includes an active area and an inactive area. The inactive area includes the pressure sensor. The pressure sensor includes one or more pressure sensitive resistors, at least one pressure sensitive resistor is disposed at a same layer as a semiconductor active layer of the active area, and the at least one pressure sensitive resistor is made of a same material as the semiconductor active layer.


