Integrated Pressure Sensor Substrate for Compact Fluid Analysis
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Solution Overview
Problem
Existing devices for determining fluid characteristics, such as hydrodynamic and hydrostatic pressure, often require separate components and larger package sizes due to the need for distinct sensors and processing units, which limits their compactness and integration in applications like mobile devices.
Innovation Solution
An apparatus comprising a common substrate with a device for determining hydrodynamic pressure and a sensor for hydrostatic pressure, both electrically coupled with an ASIC embedded in the substrate, allowing for reduced size and shared fluidic connections, and potentially including a microphone for acoustic pressure measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate components and wiring are used for determining hydrodynamic and hydrostatic pressure, then functional reliability is maintained, but package size increases
Solution Approach 1:
The patent combines separate pressure sensing components (hydrodynamic pressure sensor and hydrostatic pressure sensor) into a single integrated device on one substrate. The ASIC integrates signal processing functions for both pressure types, and the fluidic connection system merges multiple fluid pathways into a shared infrastructure, reducing overall package size while maintaining the ability to measure both pressure types independently
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for sensors, integrates the ASIC for signal processing, and incorporates fluidic pathways for both hydrodynamic and hydrostatic pressure measurements. The ASIC handles multiple signal processing tasks including amplification, filtering, and digitization for different sensor types, making the system more compact through multi-functionality
2Volume of stationary object
If multiple sensors are integrated in a single package, then package size is reduced, but manufacturing complexity increases
Solution Approach 1:
The device is segmented into distinct functional modules on the substrate: hydrodynamic pressure sensing region, hydrostatic pressure sensing region, ASIC integration area, and fluidic connection pathways. This modular segmentation allows each component to be manufactured and tested independently before final assembly, reducing overall manufacturing complexity despite the integrated design
Solution Approach 2:
The ASIC is embedded within or closely integrated with the sensor array on the substrate, creating a nested structure where smaller components are housed within or adjacent to larger structural elements. The fluidic pathways are routed through the substrate itself, nesting the fluidic infrastructure within the mechanical support structure, thereby simplifying assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact package size reduction by integrating sensors and processing units, optimizing space usage and enabling thinner products while maintaining performance, potentially reducing the package size by 50% compared to conventional systems.
Implementation Method 1
a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid
Implementation Method 2
a device to determine a hydrodynamic pressure of the fluid
Data Source
AI summary
Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.