Integrated Pressure and Temperature Sensing in Electronic Devices

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Solution Overview

Problem

Current electronic devices lack an effective pressure sensing function that can accurately detect changes in pressure and temperature, which limits their ability to provide precise input sensing and user interaction.

Innovation Solution

The electronic device incorporates a pressure sensing sensor with strain sensing patterns and connection patterns, along with a temperature sensing sensor, arranged on a base substrate with a sensing insulating layer, to detect changes in pressure and temperature, enhancing the input sensing unit's capability to sense external inputs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If pressure sensing sensor is added to the electronic device, then pressure sensing capability is improved, but device complexity increases

Engineering Contradiction:
Improvepressure sensing capabilityVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines the pressure sensing sensor with the existing input sensing unit (touch sensor) into a single integrated structure. The pressure sensing sensor shares the same substrate and is positioned in direct contact with the touch sensor's sensing region, allowing simultaneous detection of touch and pressure forces without requiring separate independent sensor systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The input sensing unit is designed to perform multiple functions: it can detect both touch events (through capacitance changes) and pressure forces (through strain sensing patterns). This multi-functional design eliminates the need for separate dedicated pressure sensing components while expanding the device's sensing capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If temperature sensing sensor is added to the electronic device, then temperature sensing capability is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature sensing capabilityVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensing sensor is integrated into the same substrate as the touch and pressure sensing components. The temperature sensing patterns are positioned adjacent to the strain sensing patterns, sharing common structural elements and manufacturing processes, thereby reducing overall device complexity while adding temperature sensing functionality.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If multiple sensing patterns are overlapped in the sensing region, then sensing precision is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesensing precisionVSAvoidmanufacturing precision
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent resolves overlapping pattern conflicts by distributing different sensing patterns across multiple layers in the vertical dimension. The touch sensor, pressure sensing sensor, and temperature sensing sensor are positioned at different heights above the substrate, with insulating layers separating them. This layered approach allows all sensing patterns to coexist without requiring perfect planar alignment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for improved pressure and temperature sensing, enabling more precise detection of external inputs and enhancing user interaction with the device.

Implementation Method 1

a pressure sensing sensor including a plurality of strain sensing patterns, which are overlapped with the sensing region

Methodology Applied
Scientific EffectStrain sensing: Piezoresistive Effect

Implementation Method 2

a temperature sensing sensor including temperature sensing patterns and temperature connection patterns connecting the temperature sensing patterns

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Data Source

PatentUS11903246B2Electronic device
Publication Date: 2024.02.13 SAMSUNG DISPLAY CO LTD
  • US11903246B2 patent drawing
  • US11903246B2 patent drawing
  • US11903246B2 patent drawing

AI summary

An electronic device includes: a base substrate including an active region, which includes a sensing region, and a peripheral region adjacent to the active region; an input sensor including a sensing insulating layer, a plurality of first sensing electrodes, a plurality of second sensing electrodes, the second sensing electrodes being spaced apart from the first sensing electrodes; and a pressure sensor including a plurality of strain sensing patterns overlapping the sensing region, and strain connection patterns connecting the strain sensing patterns to each other, wherein each of the first sensing electrodes comprises a plurality of first sensing patterns overlapping the active region, each of the second sensing electrodes comprises a plurality of second sensing patterns overlapping the active region and on a same layer as the first sensing patterns, and a plurality of second connection patterns connecting the second sensing patterns.