Integrated High-Speed Probe System Impedance Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current probe systems face challenges in transmitting high-frequency signals reliably due to impedance mismatch issues, requiring customized substrates and increasing costs, while also compromising on layout efficiency and resilience, especially when handling mixed frequency operations.
Innovation Solution
An integrated high-speed probe system with a circuit substrate divided into testing and probe areas, utilizing a high-speed substrate with a contacting layer, grounding layer, and signal wires to ensure impedance matching for high-frequency signals, allowing for simultaneous transmission of low-frequency and high-frequency signals without additional circuit space, and featuring a probe assembly with aligned contacts for improved connectivity and resilience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a standard circuit substrate is used for mass production, then manufacturing cost is reduced and ease of manufacture is improved, but impedance matching for high-frequency signals deteriorates
Solution Approach 1:
The circuit substrate is divided into a first area for low-frequency/medium-frequency signals and a second area for high-frequency signals. This segmentation allows each area to be optimized independently: the first area can use standard substrate designs for cost-effective mass production, while the second area can be specifically designed with impedance-controlled transmission paths, grounding layers, and shielding structures to maintain signal integrity for high-frequency operations.
2Adaptability or versatility
If additional flex cables are added for high-frequency signals, then high-frequency transmission capability is improved, but probe resilience deteriorates and device complexity increases
Solution Approach 1:
The patent merges the transmission paths for low-frequency and high-frequency signals into a single integrated circuit substrate rather than using separate flex cables. The substrate contains both a first area for low-frequency/medium-frequency signals and a second area for high-frequency signals, eliminating the need for additional external cables. This integration maintains probe resilience by avoiding external cable extensions while providing comprehensive frequency transmission capability through carefully designed transmission paths with impedance control and grounding structures.
3Adaptability or versatility
If the circuit substrate is divided into separate areas for low-frequency and high-frequency signals, then frequency-specific optimization is improved, but layout efficiency and probe density deteriorate
Solution Approach 1:
The circuit substrate employs local quality by assigning different structural characteristics to different areas: the first area is designed with standard routing for low-frequency/medium-frequency signals, while the second area features impedance-controlled transmission paths, dedicated grounding layers, and shielding structures optimized for high-frequency signals. This localized optimization allows each area to perform its specific function effectively while maintaining overall compactness and efficient space utilization on the substrate.
Data Source
AI summary
An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.