Integrated Probe Substrate for Short-Path RF Wafer Testing
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Solution Overview
Problem
Conventional semiconductor testers are bulky, complex, and lack flexibility to integrate test signals, particularly unable to support the use of radio frequency (RF) signals and/or high-speed digital signals for testing semiconductor wafers.
Innovation Solution
A semiconductor device with an integrated substrate that shortens the transmission path of test signals by using a circuit board, a probe, and a signal-transmitting module, which includes optical-electrical converters and optical fibers, RF components, and power supply components to facilitate efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical transmission is used to transmit test signals, then the transmission path is long and signal distortion occurs, but shortening the transmission path requires reconfiguring the tester architecture
Solution Approach 1:
An optical-electrical converter is introduced as an intermediary component between the signal source and the probe. The converter includes an optical module and an electrical module that work together to convert optical signals to electrical signals and vice versa, enabling short-distance electrical transmission while maintaining signal quality through optical transmission over longer distances.
Solution Approach 2:
The patent replaces conventional electrical transmission with optical transmission for signal delivery. Optical fibers are used to transmit test signals from the optical module to the electrical module, eliminating the need for long electrical transmission paths and reducing signal distortion.
2Productivity
If conventional testers are used for wafer testing, then the equipment is bulky and complex, but improving testing speed and RF signal support requires advanced transmission capabilities
Solution Approach 1:
The patent substitutes optical transmission infrastructure for conventional electrical transmission in tester equipment. The optical module communicates with the electrical module through optical fibers, enabling high-speed signal transmission and RF signal support while reducing equipment size and complexity compared to conventional electrical-only architectures.
Solution Approach 2:
The optical-electrical converter is designed to handle multiple signal types including high-speed digital signals and RF signals. The optical module and electrical module are configured to support both wafer testing applications and high-performance computing applications, providing universal functionality across different testing scenarios.
3Loss of information
If electrical signals are transmitted over long distances, then signal distortion and loss occur, but using optical transmission requires additional conversion components
Solution Approach 1:
The optical-electrical converter serves as a mediator that minimizes electrical signal transmission distance. The converter is positioned adjacent to the probe, allowing optical signals to be transmitted over long distances without distortion and then converted to electrical signals only when needed for probe contact, thereby eliminating long-distance electrical transmission issues.
Solution Approach 2:
The transmission system is segmented into distinct optical and electrical domains. The optical module handles long-distance transmission with optical fibers, while the electrical module handles short-distance transmission to the probe. This segmentation allows each component to operate in its optimal domain, minimizing signal loss and distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor device achieves better signal transmission quality and integrity by shortening the signal transmission path and using advanced coupling mechanisms, enabling efficient testing of semiconductor wafers and supporting high-performance computing systems.
Implementation Method 1
The signal-transmitting module comprises an optical-electrical converter and an optical fiber connected to the optical-electrical converter
Data Source
AI summary
A semiconductor device for testing a device under test includes a circuit board, a plurality of probes disposed below the circuit board and facing the device under test, an integrated substrate disposed between the circuit board and the plurality of probes, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The plurality of probes is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the plurality of probes through the integrated substrate and the circuit board to perform a test to the device under test. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.