Integrated Self-Regulated PWM Current and Power Limiter
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Solution Overview
Problem
Conventional power management systems require microcontrollers to provide over-current protection and active current and power limiting for external components, which increases the size, cost, and software overhead, and often fails to directly measure component temperatures, leading to thermal stresses.
Innovation Solution
A semiconductor device with an integrated self-regulated pulse width modulation (PWM) current and power limiter that detects temperature thresholds, adjusts the duty cycle of the output power signal using current and power limiters, and enters a self-limiting mode to reduce current and power provided to the load, allowing for temperature control without external supervision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If microcontrollers are used to control power delivery to external components, then power management control is achieved, but device size, cost, and software overhead increase
Solution Approach 1:
The patent extracts the power management control functionality from the microcontroller and implements it directly in the semiconductor device through integrated temperature sensors and PWM controllers. This removes the need for external microcontrollers to handle power management tasks, reducing device complexity while maintaining control capability.
Solution Approach 2:
The semiconductor device performs self-monitoring and self-regulation of power delivery through integrated temperature sensors and PWM controllers that automatically adjust power output based on detected temperature conditions, eliminating the need for external supervision or control software.
2Reliability
If external microcontrollers provide over-current protection and active limiting, then component protection is achieved, but the system requires more I/O ports and software overhead
Solution Approach 1:
The patent combines temperature sensing, current limiting, and power management functions into the semiconductor device itself. The temperature sensor and PWM controller are integrated together, allowing the device to monitor and regulate its own operating conditions without requiring separate external components or multiple I/O ports.
Solution Approach 2:
The integrated PWM controller serves multiple functions: it controls power delivery to the load, monitors temperature through the integrated sensor, and implements both current and power limiting based on temperature conditions. This multi-functionality eliminates the need for separate protection circuits and software management.
3Device complexity
If conventional systems do not directly measure component temperatures, then system simplicity is maintained, but thermal stresses and overheating damage occur
Solution Approach 1:
The patent implements a feedback mechanism where the integrated temperature sensor continuously monitors the semiconductor device's temperature and feeds this information to the PWM controller. The controller then adjusts the duty cycle of the PWM signal to the power stage based on this temperature feedback, creating a closed-loop thermal management system that prevents overheating.
Solution Approach 2:
The patent replaces mechanical or external thermal management approaches with an integrated electronic sensing and control system. The temperature sensor provides direct electrical measurement of thermal conditions, and the PWM controller electronically adjusts power delivery in real-time based on these measurements, eliminating the need for external thermal management hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the number of I/O ports needed in microcontrollers, enables cheaper and smaller designs, allows for stand-alone operation, and reduces thermal stresses by directly measuring and controlling temperature, thereby preventing overheating and damage.
Implementation Method 1
a temperature sensor configured to detect temperature above a threshold in the output power device
Implementation Method 2
generating an output power signal at the output power device in response to receiving the activation signal, the output power signal having a duty cycle
Implementation Method 3
measuring at least one of a power level and a current level of the output power signal
Data Source
Figure 1~3A
Figure 2
Figure 3B~3C
AI summary
A method includes receiving an activation signal at a semiconductor device and generating an output power signal at the semiconductor device in response to receiving the activation signal. The output power signal has a duty cycle. The method also includes providing the output power signal to a load. The output power signal provides power to the load. An amount of power provided to the load is based on the duty cycle of the output power signal. In addition, the method includes adjusting the duty cycle of the output power signal using at least one of a current limiter and a power limiter integrated in the semiconductor device.